Solder Alloy, Solder Ball, Solder Preform, Solder Joint, and Circuit
AssigneeSenju Metal Industry Co., Ltd.
InventorsKota Sugisawa, Yuki Iijima, Shunsaku Yoshikawa
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Abstract
Provided are a solder alloy, a solder ball, a solder preform, a solder joint, and a circuit which have excellent wettability and shear strength, as well as an appropriate fracture mode, suppressed growth of an intermetallic compound at a joint interface even after reflowing is performed a plurality of times, excellent drop impact resistance, and an appropriate bump shape. The solder alloy has an alloy composition of, by mass %, Ag: 0.10 to 3.00%, Cu: 0.80 to 6.00%, Ni: 0.08 to 0.60%, Ge: 0.0010 to 0.0150%, with the balance being Sn. the alloy composition may further contain at least one of Bi, Sb, In, Zn, Ga, Mn, Cr, Co, Si, Ti, and rare earth elements: 0.1% or less in total.
Claims12
A solder alloy having an alloy composition consisting of, by mass %, Ag:
- 0.10 to 3.00%, Cu:
- 0.80 to 6.00%, Ni:
- 0.08 to 0.60%, Ge:
- 0.0010 to 0.0150%, with the balance being Sn.
Dependencies are inferred from the claim text.