Planar solder joint with diagonal trace for determining solder dimension to prevent electromigration
AssigneeInternational Business Machines Corporation
InventorPrabjit SINGH
Life of this patent
Estimating the term…
Abstract
A substrate may comprise a first conductive trace over a substrate and a second conductive trace over the substrate. The first conductive trace and the second conductive trace may be separated by a length. The substrate may include a solder joint bridging the first conductive trace and the second conductive trace and a third conductive trace diagonally bisecting the solder joint to form a first solder joint portion and a second solder joint portion. A first length of the first solder joint portion may taper to zero from the length. A second length of the second solder joint portion may taper to zero from the length.
Claims20
A method, comprising:
- forming a first conductive trace over a substrate;
- forming a second conductive trace over the substrate,
- wherein the first conductive trace and the second conductive trace are separated by a length, and
- wherein a first width of the first conductive trace is equal to a second width of the second conductive trace;
- forming a third conductive trace between the first conductive trace and the second conductive trace,
- wherein the third conductive trace is provided diagonally between the first conductive trace and the second conductive trace;
- and
- forming a solder joint between the first conductive trace and the second conductive trace, wherein the third conductive trace bisects the solder joint diagonally to form a first solder joint portion and a second solder joint portion.
A substrate comprising:
- a first conductive trace over a substrate;
- a second conductive trace over the substrate,
- wherein the first conductive trace and the second conductive trace are separated by a length;
- a solder joint bridging the first conductive trace and the second conductive trace;
- and
- a third conductive trace diagonally bisecting the solder joint to form a first solder joint portion and a second solder joint portion,
- wherein a first length of the first solder joint portion tapers to zero from the length, and
- wherein a second length of the second solder joint portion tapers to zero from the length.
A substrate comprising:
- a first conductive trace over a substrate;
- a second conductive trace over the substrate;
- a planar, thin, rectangular solder joint bridging a first conductive trace and a second conductive trace that are of a same thickness and width;
- and
- a third conductive trace that diagonally bisects the solder joint to provide two solder joint portions, each solder joint point having a length tapering to zero such that each solder joint portion ensures uniform current density.
Dependencies are inferred from the claim text.