H05K 3/3489
Composition of fluxes
Official title: Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
H05K3/3489 (Composition of fluxes) appears on 567 US grants and 411 published applications in this corpus.
Search patents in H05K- Granted patents
- 567
- Published applications
- 411
- Assignees
- 275
- Inventors
- 1,353
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 6 | 0 |
| 1978 | 3 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 4 | 0 |
| 1989 | 10 | 0 |
| 1990 | 5 | 0 |
| 1991 | 14 | 0 |
| 1992 | 18 | 0 |
| 1993 | 21 | 0 |
| 1994 | 16 | 0 |
| 1995 | 20 | 0 |
| 1996 | 17 | 0 |
| 1997 | 17 | 0 |
| 1998 | 19 | 0 |
| 1999 | 16 | 0 |
| 2000 | 20 | 0 |
| 2001 | 20 | 14 |
| 2002 | 19 | 18 |
| 2003 | 26 | 24 |
| 2004 | 29 | 31 |
| 2005 | 17 | 23 |
| 2006 | 12 | 25 |
| 2007 | 12 | 27 |
| 2008 | 7 | 17 |
| 2009 | 14 | 18 |
| 2010 | 16 | 17 |
| 2011 | 8 | 15 |
| 2012 | 11 | 20 |
| 2013 | 17 | 17 |
| 2014 | 9 | 10 |
| 2015 | 9 | 18 |
| 2016 | 9 | 14 |
| 2017 | 18 | 14 |
| 2018 | 11 | 16 |
| 2019 | 9 | 17 |
| 2020 | 9 | 8 |
| 2021 | 8 | 10 |
| 2022 | 7 | 7 |
| 2023 | 13 | 8 |
| 2024 | 4 | 14 |
| 2025 | 12 | 6 |
| 2026 | 6 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Light-absorbing epoxy film and manufacturing method thereof2 Jun 2026US 12,643,182 B2Hojeonable Inc.
- Non-electroconductive flux, connected structure, and method for producing connected structure31 Mar 2026US 12,589,452 B2Sekisui Chemical Co., Ltd.
- Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control device10 Mar 2026US 12,569,940 B2Tamura Corporation
- Method of bonding column type deposits3 Mar 2026US 12,568,589 B2Protec Co., Ltd.
- Component isolation during plasma exposure6 Aug 2026US 2026/0231340 A1Skyworks Solutions, Inc.
- Preheating mechanism of jet soldering apparatus, and jet soldering apparatus16 Jul 2026US 2026/0199996 A1Koki Tec Corp.
- Bonding structure5 Mar 2026US 2026/0068046 A1Advanced Semiconductor Engineering, Inc.
- Radiopaque particle processing additive6 Nov 2025US 2025/0342978 A1Honeywell Federal Manufacturing & Technologies, LLC
- Method for adjusting flux distribution positions on circuit board9 Oct 2025US 2025/0318054 A1Jetbest Corporation
Most cited
By later US patents
- Flexible preformed planar structures for interposing between a chip and a substrate242US 5,489,804 ALSI Logic Corporation · 1996
- Process for interconnecting conductive substrates using an interposer having conductive plastic filled vias220US 5,468,681 ALSI Logic Corporation · 1995
- Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device207US 5,643,831 AFujitsu Limited · 1997
- Method of forming solder terminals for a pinless ceramic module160US 4,830,264 AInternational Business Machines Corporation · 1989
- Multilayer printed circuit154US 5,716,663 AToranaga Technologies, Inc. · 1998