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US 12,568,589 B2Granted
Method of bonding column type deposits
AssigneeProtec Co., Ltd.
InventorsYoun Sung Ko, Geunsik Ahn
Life of this patent
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Abstract
Provided is a method of bonding column type deposits, and more specifically, a method of bonding, to a substrate, column type deposits which are formed in a column shape and connect a substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. The method of bonding the column type deposits to the substrate enables bonding the column type deposits having a high aspect ratio to accurate positions while being kept aligned vertically on the substrate.
Claims8
A method of bonding column type deposits, the method comprising:
- (a) preparing a substrate on which metal connection layers are formed on a plurality of electrode pads, respectively;
- (b) applying a flux to the metal connection layers of the plurality of electrode pads on the substrate;
- (c) mounting column type deposits on upper surfaces of the metal connection layers on the flux-applied substrate, respectively;
- (d) rotating the substrate on which the column type deposits have been mounted, so that the column type deposits are suspended upside down to the substrate by the flux, wherein the step (d) comprises:
- (d-1) pressing the column type deposits onto an upper surface of the substrate by using a pressing plate;
- and
- (d-2) simultaneously turning the pressing plate and the substrate upside down;
- (e) heating an assembly of the substrate and the column type deposits to melt the metal connection layers of the substrate;
- and
- (f) cooling the assembly of the substrate and the column type deposits so that the melted metal connection layers of the substrate are hardened, after completion of the step (e).
7 more elements
Dependencies are inferred from the claim text.