Light-absorbing epoxy film and manufacturing method thereof
AssigneeHojeonable Inc.
InventorsJong Tae Moon, Kwang Mo Jung
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Abstract
Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.
Claims14
A light-absorbing epoxy flux film composition comprising a surface-modified light-absorbing material, an epoxy resin comprising a first epoxy resin and a second epoxy resin, a phenoxy resin, a surfactant, a catalyst, a curing agent, a reductant comprising a first reducing agent and a second reducing agent, and a non-aqueous silicone anti-foaming agent,
- wherein the first reducing agent is in an amount of 50 to 150 parts by weight with respect to 100 parts by weight of the first epoxy resin, and
- wherein the second reducing agent is in an amount of 40 to 140 parts by weight with respect to 100 parts by weight of the first epoxy resin.
A method of manufacturing a light-absorbing epoxy flux film, the method comprising:
- (first step) modifying a surface of a light-absorbing material with an epoxy-based silane coupling agent;
- (second step) mixing an epoxy resin, a phenoxy resin, and a surface-modified light-absorbing material to form a first mixture;
- (third step) adding and mixing a catalyst and a first reducing agent to and with the first mixture to form a second mixture;
- (fourth step) adding and mixing a second reducing agent to and with the second mixture to form a third mixture;
- (fifth step) adding and mixing a curing agent, a catalyst, a surfactant, and a non-aqueous silicone anti-foaming agent to and with the third mixture to produce a light-absorbing epoxy flux film precursor;
- and
- (sixth step) curing the light-absorbing epoxy flux film precursor to produce the light-absorbing epoxy flux film;
- wherein the first reducing agent is in an amount of 50 to 150 parts by weight with respect to 100 parts by weight of the first epoxy resin, and
- wherein the second reducing agent is in an amount of 40 to 140 parts by weight with respect to 100 parts by weight of the first epoxy resin.
Dependencies are inferred from the claim text.