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US 2026/0068046 A1Published application
Bonding structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChih-Jing HSU, Hsu-Nan FANG
Life of this patent
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Abstract
A bonding structure is provided. The bonding structure includes a first substrate, a dielectric layer, a second substrate, a reflowable element, and a dielectric adhesive element. The dielectric layer is over the first substrate. The second substrate is over the first substrate. The reflowable element connects the first substrate to the second substrate. The dielectric adhesive element encapsulates the reflowable element and partially horizontally overlaps the dielectric layer.
Claims20
A bonding structure, comprising:
- a first substrate;
- a dielectric layer over the first substrate;
- a second substrate over the first substrate;
- a reflowable element connecting the first substrate to the second substrate;
- and
- a dielectric adhesive element encapsulating the reflowable element and partially horizontally overlapping the dielectric layer.
3 more elements
A bonding structure, comprising:
- a first substrate;
- a second substrate over the first substrate;
- a reflowable element connecting the first substrate to the second substrate;
- a first dielectric layer extending from the second substrate towards the first substrate;
- and
- a second dielectric layer connected to the first dielectric layer and comprising a dam structure configured to compensate for an extension amount of the first dielectric layer to reduce a formation of voids.
3 more elements
A bonding structure, comprising:
- a first substrate;
- a second substrate over the first substrate;
- and
- a solder element connecting the first substrate to the second substrate, wherein a lateral surface of the solder element comprises a first portion adjacent to the first substrate, a second portion adjacent to the second substrate, and a third portion between the first portion and the second portion and concave toward an inner part of the solder element.
1 more element
Dependencies are inferred from the claim text.