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US 12,569,940 B2Granted
Solder alloy, joint portion, joining material, solder paste, joint structure, and electronic control device
AssigneeTamura Corporation
InventorsTakanori Shimazaki, Daisuke Maruyama, Genki Ochi, Masaya Arai
Life of this patent
Estimating the term…
Abstract
A solder alloy includes 45 mass % or more and 63 mass % or less of Bi, 0.1 mass % or more and less than 0.7 mass % of Sb, 0.05 mass % or more and 1 mass % or less of In, and a balance including Sn.
Claims15
A solder alloy consisting of:
- 45 mass % or more and 63 mass % or less of Bi;
- 0.1 mass % or more and less than 0.7 mass % of Sb;
- 0.05 mass % or more and 1 mass % or less of In;
- and
- optionally one or more selected from P, Ga, and Ge in a total amount of 0.001 mass % or more and 0.05 mass % or less;
- optionally one or more selected from Mn, Ti, Al, Cr, V, and Mo in a total amount of 0.001 mass % or more and 0.05 mass % or less;
- and
- a balance including Sn.
5 more elements
A joining material comprising:
- a solder alloy consisting of:
- 45 mass % or more and 63 mass % or less of Bi;
- 0.1 mass % or more and less than 0.7 mass % of Sb;
- 0.05 mass % or more and 1 mass % or less of In;
- optionally one or more selected from P, Ga, and Ge in a total amount of 0.001 mass % or more and 0.05 mass % or less;
- optionally one or more selected from Mn, Ti, Al, Cr, V, and Mo in a total amount of 0.001 mass % or more and 0.05 mass % or less;
- and
- a balance including Sn.
5 more elements
A solder paste comprising:
- a flux;
- and
- a powder made of a solder alloy consisting of:
- 45 mass % or more and 63 mass % or less of Bi;
- 0.1 mass % or more and less than 0.7 mass % of Sb;
- 0.05 mass % or more and 1 mass % or less of In;
- and
- optionally one or more selected from P, Ga, and Ge in a total amount of 0.001 mass % or more and 0.05 mass % or less;
- optionally one or more selected from Mn, Ti, Al, Cr, V, and Mo in a total amount of 0.001 mass % or more and 0.05 mass % or less;
- and
- a balance including Sn.
8 more elements
Dependencies are inferred from the claim text.