H05K 3/3452
Solder masks
H05K3/3452 (Solder masks) appears on 1,445 US grants and 1,351 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,445
- Published applications
- 1,351
- Assignees
- 571
- Inventors
- 3,176
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 7 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 5 | 0 |
| 1986 | 10 | 0 |
| 1987 | 8 | 0 |
| 1988 | 16 | 0 |
| 1989 | 14 | 0 |
| 1990 | 12 | 0 |
| 1991 | 19 | 0 |
| 1992 | 11 | 0 |
| 1993 | 18 | 0 |
| 1994 | 22 | 0 |
| 1995 | 29 | 0 |
| 1996 | 33 | 0 |
| 1997 | 26 | 0 |
| 1998 | 40 | 0 |
| 1999 | 38 | 0 |
| 2000 | 40 | 0 |
| 2001 | 61 | 20 |
| 2002 | 52 | 46 |
| 2003 | 53 | 51 |
| 2004 | 36 | 53 |
| 2005 | 36 | 82 |
| 2006 | 36 | 74 |
| 2007 | 44 | 89 |
| 2008 | 58 | 103 |
| 2009 | 49 | 108 |
| 2010 | 57 | 70 |
| 2011 | 60 | 55 |
| 2012 | 70 | 64 |
| 2013 | 40 | 44 |
| 2014 | 37 | 68 |
| 2015 | 40 | 48 |
| 2016 | 49 | 34 |
| 2017 | 44 | 32 |
| 2018 | 27 | 32 |
| 2019 | 35 | 41 |
| 2020 | 34 | 38 |
| 2021 | 26 | 30 |
| 2022 | 24 | 29 |
| 2023 | 28 | 41 |
| 2024 | 25 | 41 |
| 2025 | 33 | 34 |
| 2026 | 19 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Technologies for reducing the impact of radiofrequency interference on a circuit board6 Oct 2026US 12,757,317 B2Intel Corporation
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Reworking solder component without part removal28 Jul 2026US 12,696,399 B2International Business Machines Corporation
- Microparticle arraying mask16 Jun 2026US 12,660,096 B2Dexerials Corporation
- Circuit board26 May 2026US 12,641,720 B2LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Electronic circuit board, image forming apparatus, and method for manufacturing electronic circuit board20 Aug 2026US 2026/0247544 A1Canon Kabushiki Kaisha
- Circuit board30 Jul 2026US 2026/0223281 A1Fanuc Corporation
- Printed circuit board and manufacturing method thereof16 Jul 2026US 2026/0206134 A1Samsung Electro-Mechanics Co., Ltd.
- Self-centering electrical contacts2 Jul 2026US 2026/0188932 A1Raytheon Company
Most cited
By later US patents
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders244US 5,203,075 AInernational Business Machines Corporation · 1993
- Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements205US 5,757,074 AHughes Electronics Corporation · 1998
- Solder ball land metal structure of ball grid semiconductor package176US 5,872,399 AAmkor Technology, Inc. · 1999
- Circuit wiring disposed on solder mask coating161US 4,706,167 ATelemark Co., Inc. · 1987