H05K 3/3494
Heating processes for reflow soldering
H05K3/3494 (Heating processes for reflow soldering) appears on 1,003 US grants and 890 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,003
- Published applications
- 890
- Assignees
- 512
- Inventors
- 2,401
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 4 | 0 |
| 1985 | 6 | 0 |
| 1986 | 11 | 0 |
| 1987 | 8 | 0 |
| 1988 | 16 | 0 |
| 1989 | 22 | 0 |
| 1990 | 30 | 0 |
| 1991 | 23 | 0 |
| 1992 | 21 | 0 |
| 1993 | 15 | 0 |
| 1994 | 17 | 0 |
| 1995 | 17 | 0 |
| 1996 | 20 | 0 |
| 1997 | 19 | 0 |
| 1998 | 27 | 0 |
| 1999 | 22 | 0 |
| 2000 | 34 | 0 |
| 2001 | 31 | 14 |
| 2002 | 38 | 32 |
| 2003 | 25 | 32 |
| 2004 | 25 | 41 |
| 2005 | 20 | 41 |
| 2006 | 21 | 47 |
| 2007 | 25 | 48 |
| 2008 | 23 | 42 |
| 2009 | 24 | 50 |
| 2010 | 29 | 42 |
| 2011 | 28 | 21 |
| 2012 | 21 | 20 |
| 2013 | 19 | 22 |
| 2014 | 18 | 34 |
| 2015 | 23 | 41 |
| 2016 | 24 | 38 |
| 2017 | 46 | 39 |
| 2018 | 21 | 40 |
| 2019 | 30 | 43 |
| 2020 | 39 | 30 |
| 2021 | 27 | 37 |
| 2022 | 31 | 33 |
| 2023 | 24 | 34 |
| 2024 | 23 | 29 |
| 2025 | 19 | 17 |
| 2026 | 19 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Self correcting oven technology11 Aug 2026US 12,703,036 B2Jabil Inc.
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,701,664 B2Samsung Electronics Co., Ltd.
- Reworking solder component without part removal28 Jul 2026US 12,696,399 B2International Business Machines Corporation
- Sintering composition21 Jul 2026US 12,686,052 B2Alpha Assembly Solutions Inc.
- Method for manufacturing a printed circuit board with an embedded shield21 Jul 2026US 12,690,139 B2
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Manufacturing method for component mounting substrate24 Sep 2026US 2026/0292999 A1Panasonic Intellectual Property Management Co., Ltd.
- Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow24 Sep 2026US 2026/0293000 A1Jabil Inc.
- Leadframe mounting with lead insertion for lead wall bonding17 Sep 2026US 2026/0282230 A1Semiconductor Components Industries, LLC
- Component covers inhibiting dynamic component warping during reflow10 Sep 2026US 2026/0271194 A1International Business Machines Corporation
Most cited
By later US patents
- Component crimping apparatus control method, component crimping apparatus, and measuring tool472US 8,078,310 B2Panasonic Corporation · 2011
- Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument118US 6,812,549 B2Seiko Epson Corporation · 2004
- Method for underencapsulating components on circuit supporting substrates107US 5,386,624 AMotorola, Inc. · 1995
- Method of making reactive multilayer foil and resulting product95US 6,534,194 B2The Johns Hopkins University · 2003
- Terminal-carrying circuit board93US 5,656,798 AMatsushita Electric Works, Ltd. · 1997