Method for underencapsulating components on circuit supporting substrates
AssigneeMotorola, Inc.
InventorsReed A. George, Richard L. Mangold, Richard K. Brooks
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Abstract
A method and apparatus for underencapsulating a component (502) on a substrate (402). The method robotically places an underencapsulant film (406) on at least one surface of a first surface of the component (502) and a second surface of a substrate (402), the first and second surfaces substantially opposing each other when the component (502) is placed on the substrate (402). Next, the method places the component (502) on the substrate (402) to dispose the underencapsulant film (406) between the first and second surfaces. The method then bonds (1006,1008 or 1006,1010) the component (502) to the substrate (402) with the underencapsulant (406).
Claims12
A method for underencapsulating a component on a substrate, comprising the steps of:
- robotically placing a pre-cut underencapsulant film on at least one surface of a first surface of a component and a second surface of a substrate, the first and second surfaces substantially opposing each other when the component is placed on the substrate;
- placing the component on the substrate to dispose the underencapsulant film between the first and second surfaces;
- and
- bonding the component to the substrate with the underencapsulant.
A method for manufacturing an electronic device, the electronic device comprising a component and a substrate, the method comprising the steps of:
- robotically placing a pre-cut underencapsulant film on a surface of a substrate;
- placing a component on the substrate such that the underencapsulant film is substantially disposed between the component and the substrate;
- and
- bonding the component to the substrate with the underencapsulant film.
Dependencies are inferred from the claim text.