H05K 3/328
By welding
Official title: by welding
H05K3/328 (By welding) appears on 559 US grants and 519 published applications in this corpus.
Search patents in H05K- Granted patents
- 559
- Published applications
- 519
- Assignees
- 368
- Inventors
- 1,401
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 7 | 0 |
| 1991 | 10 | 0 |
| 1992 | 7 | 0 |
| 1993 | 8 | 0 |
| 1994 | 18 | 0 |
| 1995 | 14 | 0 |
| 1996 | 16 | 0 |
| 1997 | 8 | 0 |
| 1998 | 19 | 0 |
| 1999 | 9 | 0 |
| 2000 | 15 | 0 |
| 2001 | 15 | 14 |
| 2002 | 16 | 29 |
| 2003 | 31 | 28 |
| 2004 | 17 | 24 |
| 2005 | 18 | 27 |
| 2006 | 14 | 22 |
| 2007 | 13 | 24 |
| 2008 | 12 | 27 |
| 2009 | 14 | 21 |
| 2010 | 18 | 26 |
| 2011 | 19 | 19 |
| 2012 | 18 | 18 |
| 2013 | 15 | 8 |
| 2014 | 8 | 11 |
| 2015 | 6 | 8 |
| 2016 | 13 | 18 |
| 2017 | 13 | 24 |
| 2018 | 19 | 18 |
| 2019 | 12 | 19 |
| 2020 | 20 | 20 |
| 2021 | 11 | 28 |
| 2022 | 12 | 18 |
| 2023 | 18 | 15 |
| 2024 | 20 | 21 |
| 2025 | 14 | 20 |
| 2026 | 7 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Camera module comprising circuit board with lateral connecting belts22 Sep 2026US 12,744,982 B2Ningbo Sunny Opotech Co., Ltd.
- Flexible interconnect circuits comprising welded connections25 Aug 2026US 12,720,679 B2CelLink Corporation
- Fixed equipment, alignment system and method11 Aug 2026US 12,706,427 B2TE Connectivity Services GmbH
- Printed circuit board, manufacturing method thereof, and battery pack including the same4 Aug 2026US 12,701,656 B2LG Energy Solution, Ltd.
- Electronic component including outermost layer of outer electrode not electrically connected to inner electrode and method for producing mount structure28 Apr 2026US 12,614,673 B2Murata Manufacturing Co., Ltd.
- Method for producing an smd semiconductor assembly populated with a circuit carrier, smd semiconductor assembly, and circuit carrier20 Aug 2026US 2026/0247992 A1iCuTech - Anlagenbau GmbH
- Method for producing electronic component and method for producing mount structure6 Aug 2026US 2026/0229412 A1Murata Manufacturing Co., Ltd.
- Sensing Assembly and Battery Module2 Jul 2026US 2026/0188875 A1SK On Co., Ltd.
- Layer ribbon construction for laser ribbon bonding process25 Jun 2026US 2026/0175039 A1Cardiac Pacemakers, Inc.
- Circuit substrate having improved bonding structure18 Jun 2026US 2026/0173266 A1Tong Hsing Electronic Industries, Ltd.
Most cited
By later US patents
- Method for forming contact pins for semiconductor dice and interconnects364US 5,495,667 AMicron Technology, Inc. · 1996
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Particle-enhanced joining of metal surfaces233US 5,083,697 A1992
- Wire bond attachment of a integrated circuit package to a heat sink217US 5,933,327 AEricsson Inc. · 1999
- Interconnect adapter and head suspension assembly185US 6,025,988 ARead-Rite Corporation · 2000