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US 12,614,673 B2Granted
Electronic component including outermost layer of outer electrode not electrically connected to inner electrode and method for producing mount structure
AssigneeMurata Manufacturing Co., Ltd.
InventorYasuhiro Nishisaka
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Abstract
An electronic component includes a body, an inner electrode within the body, and an outer electrode outside of the body, wherein the outer electrode includes an outermost layer that includes metal particles but is not electrically connected to the inner electrode.
Claims11
An electronic component comprising:
- a body;
- an inner electrode within the body;
- and
- an outer electrode outside of the body;
- wherein
- the outer electrode includes an outermost layer that includes metal particles and is not electrically connected to the inner electrode;
- the outermost layer is configured to be electrically connected to the inner electrode after the metal particles are sintered;
- and
- the outermost layer of the outer electrode further includes a thermally decomposable resin.
6 more elements
A method for producing a mount structure, the method comprising:
- providing an electronic component including:
- a body;
- an inner electrode within the body;
- and
- an outer electrode outside of the body;
- wherein
- the outer electrode includes an outermost layer that includes metal particles and is not electrically connected to the inner electrode;
- and
- the outermost layer is configured to be electrically connected to the inner electrode after the metal particles are sintered;
- mounting the electronic component on a land of a circuit board;
- and
- firing the electronic component on the land;
- wherein
- the firing the electronic component is performed to sinter the metal particles included in the outermost layer of the outer electrode.
11 more elements
Dependencies are inferred from the claim text.