H05K 3/321
By conductive adhesives
Official title: by conductive adhesives
H05K3/321 (By conductive adhesives) appears on 2,582 US grants and 2,471 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,582
- Published applications
- 2,471
- Assignees
- 879
- Inventors
- 5,038
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 5 | 0 |
| 1985 | 8 | 0 |
| 1986 | 17 | 0 |
| 1987 | 22 | 0 |
| 1988 | 22 | 0 |
| 1989 | 17 | 0 |
| 1990 | 14 | 0 |
| 1991 | 26 | 0 |
| 1992 | 27 | 0 |
| 1993 | 24 | 0 |
| 1994 | 33 | 0 |
| 1995 | 39 | 0 |
| 1996 | 33 | 0 |
| 1997 | 45 | 0 |
| 1998 | 68 | 0 |
| 1999 | 61 | 0 |
| 2000 | 69 | 0 |
| 2001 | 85 | 40 |
| 2002 | 89 | 115 |
| 2003 | 87 | 102 |
| 2004 | 84 | 103 |
| 2005 | 72 | 116 |
| 2006 | 73 | 120 |
| 2007 | 71 | 149 |
| 2008 | 60 | 123 |
| 2009 | 81 | 165 |
| 2010 | 101 | 143 |
| 2011 | 101 | 106 |
| 2012 | 114 | 86 |
| 2013 | 82 | 74 |
| 2014 | 76 | 86 |
| 2015 | 66 | 78 |
| 2016 | 68 | 98 |
| 2017 | 67 | 83 |
| 2018 | 78 | 84 |
| 2019 | 96 | 81 |
| 2020 | 91 | 109 |
| 2021 | 75 | 100 |
| 2022 | 84 | 96 |
| 2023 | 74 | 80 |
| 2024 | 65 | 59 |
| 2025 | 54 | 37 |
| 2026 | 36 | 38 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electronic device29 Sep 2026US 12,750,946 B2Kmw Inc.
- Lens driving device, camera device, and optical apparatus including same22 Sep 2026US 12,745,352 B2LG Innotek Co., Ltd.
- Compact interface through hinge connector25 Aug 2026US 12,720,678 B2Apple Inc.
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Eye-tracking system including a ring-shaped printed circuit board having extensions and illumination sources coupled to the extensions18 Aug 2026US 12,710,652 B2Meta Platforms Technologies, LLC
- Circuit forming method and circuit forming apparatus1 Oct 2026US 2026/0304641 A1Fuji Corporation
- Pre-connected analyte sensors24 Sep 2026US 2026/0292997 A1DexCom, Inc.
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
Most cited
By later US patents
- Thermal management system for L.E.D. arrays482US 5,857,767 ARelume Corporation · 1999
- Component crimping apparatus control method, component crimping apparatus, and measuring tool472US 8,078,310 B2Panasonic Corporation · 2011
- Electro-optic display and materials for use therein447US 7,535,624 B2E Ink Corporation · 2009
- Method of manufacturing and testing an electronic device, and an electronic device285US 6,167,614 AMicron Technology, Inc. · 2001
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995