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AssigneeMicron Technology, Inc.
InventorsMark E. Tuttle, Rickie C. Lake, Curtis M. Medlen
Estimating the term…
A method of manufacturing and testing an electronic circuit, the method comprising forming a plurality of conductive traces on a substrate and providing a gap in one of the conductive traces; attaching a circuit component to the substrate and coupling the circuit component to at least one of the conductive traces; supporting a battery on the substrate, and coupling the battery to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; verifying electrical connections by performing an in circuit test, after the circuit component is attached and the battery is supported; and employing a jumper to electrically close the gap, and complete the circuit, after verifying electrical connections. An electronic circuit comprising a substrate; a plurality of conductive traces on the substrate, with a gap in one of the conductive traces; a circuit component attached to the substrate and coupled to at least one of the conductive traces; a battery supported on the substrate and coupled to at least one of the conductive traces, wherein a completed circuit would be defined, including the traces, circuit component, and battery, but for the gap; and a jumper electrically closing the gap and completing the circuit, the jumper comprising conductive epoxy.
A method of manufacturing and testing an electronic circuit, the method comprising:
A method of manufacturing and testing an electronic circuit, the method comprising:
A method of manufacturing and testing an electronic circuit, the method comprising:
A method of manufacturing and testing an electronic circuit, the method comprising:
Dependencies are inferred from the claim text.