Compact interface through hinge connector

An electronic device comprising:

• a first electronic device comprising:
• a printed circuit board having a quad plug connector coupled to a first surface of the printed circuit board;
• first and second sets of pads coupled to a second surface of the printed circuit board;
• and
• a ground bar coupled to the second surface of the printed circuit board;
• a first plurality of wires coupled to the second surface of the printed circuit board using a first hot bar connection configured to couple the first plurality of wires to the first set of pads, wherein the first plurality of wires are parallel to each other and are located on a first plane, and the first plurality of wires is coupled to the ground bar;
• and
• a second plurality of wires coupled to the second surface of the printed circuit board using a second hot bar connection configured to couple the second plurality of wires to the second set of pads, wherein the second plurality of wires are parallel to each other and are located on a second plane, the second plurality of wires is coupled to the ground bar, the first and second planes are each parallel to each other and to the second surface of the printed circuit board, and the first plurality of wires is vertically above the second plurality of wires.

A method of manufacturing an interface, comprising:

• coupling a first plurality of wires to a first plurality of pads on a printed circuit board;
• coupling a second plurality of wires to a second plurality of pads on the printed circuit board;
• coupling a ground bar to the printed circuit board, wherein the first and second pluralities of wires abut the ground bar;
• disposing an insulation layer on the first and second pluralities of wires and the first and second pluralities of pads;
• and
• disposing an adhesive film carrying conductive material on the insulation layer, the ground bar, and the printed circuit board;
• and
• electrically bonding the adhesive film carrying conductive material to electrically couple the ground bar and a ground connection of the printed circuit board to implement a shield layer configured to at least partially block electromagnetic interference from escaping from the first plurality of pads and the second plurality of pads.