H05K 3/323
By applying an anisotropic conductive adhesive layer over an array of pads
Official title: {by applying an anisotropic conductive adhesive layer over an array of pads}
H05K3/323 (By applying an anisotropic conductive adhesive layer over an array of pads) appears on 1,406 US grants and 1,467 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,406
- Published applications
- 1,467
- Assignees
- 474
- Inventors
- 2,769
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 6 | 0 |
| 1987 | 8 | 0 |
| 1988 | 9 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 12 | 0 |
| 1992 | 14 | 0 |
| 1993 | 11 | 0 |
| 1994 | 18 | 0 |
| 1995 | 13 | 0 |
| 1996 | 14 | 0 |
| 1997 | 24 | 0 |
| 1998 | 34 | 0 |
| 1999 | 17 | 0 |
| 2000 | 25 | 0 |
| 2001 | 31 | 22 |
| 2002 | 43 | 47 |
| 2003 | 41 | 46 |
| 2004 | 41 | 52 |
| 2005 | 38 | 57 |
| 2006 | 33 | 73 |
| 2007 | 38 | 90 |
| 2008 | 33 | 76 |
| 2009 | 54 | 108 |
| 2010 | 64 | 96 |
| 2011 | 69 | 67 |
| 2012 | 75 | 55 |
| 2013 | 51 | 42 |
| 2014 | 43 | 59 |
| 2015 | 47 | 52 |
| 2016 | 40 | 60 |
| 2017 | 38 | 54 |
| 2018 | 48 | 48 |
| 2019 | 57 | 52 |
| 2020 | 49 | 68 |
| 2021 | 52 | 62 |
| 2022 | 57 | 63 |
| 2023 | 48 | 49 |
| 2024 | 39 | 30 |
| 2025 | 35 | 20 |
| 2026 | 20 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Stretchable circuit substrate and stretchable device30 Jul 2026US 2026/0223286 A1TDK Corporation
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Most cited
By later US patents
- Component crimping apparatus control method, component crimping apparatus, and measuring tool472US 8,078,310 B2Panasonic Corporation · 2011
- Electro-optic display and materials for use therein447US 7,535,624 B2E Ink Corporation · 2009
- Electronic apparatus and a method for manufacturing the same248US 5,038,251 ACasio Computer Co., Ltd. · 1991
- Method for interconnecting a flip chip to a printed circuit substrate194US 5,615,477 ASheldahl, Inc. · 1997
- Rigid-flex board with anisotropic interconnect and method of manufacture175US 5,428,190 ASheldahl, Inc. · 1995