Electronic apparatus and a method for manufacturing the same

An electronic apparatus having, electronic components which are disposed in upper and lower covers comprising:

• a film board in which an opening larger than dimensions of an IC pellet is formed;
• a plurality of metal foil leads fixed on an upper surface of said film board and each having one end extending inside said opening and located at a level lower than the upper surface of said film board and the other end extending toward an outer peripheral portion of said film board and formed to have a width larger than that of the one end, the pitch of the other ends being larger than that of the one ends;
• an IC pellet having bump electrodes connected to said one ends of said metal foil leads, respectively;
• a wiring board having connecting terminals respectively opposing the other ends of said metal foil leads;
• and
• an anisotropically electrical conductive adhesive interposed between said film board and said wiring board to electrically connect the other ends of said metal foil leads and said connecting terminals of said wiring board and to bond said film board to said wiring board.