Electronic device and method for manufacturing same

An electronic device comprising:

• an electronic element substrate including a first substrate, a plurality of electronic elements formed on the first substrate, and a plurality of wiring lines connected to the plurality of electronic elements;
• a second substrate disposed on the first substrate in such a way as to expose a terminal area where a plurality of terminals of the plurality of wiring lines of the first substrate is formed;
• a flexible circuit board including a film and circuitry, the film being flexible, the circuitry being provided on the film;
• an anisotropic conductive resin layer disposed between the terminal area of the first substrate and the film in such a way as to electrically connect the circuitry to the plurality of terminals;
• and
• a moisture-proof resin portion formed in contact with the first substrate, the second substrate, and the film, wherein
• the moisture-proof resin portion is formed at a position closer to the second substrate than the anisotropic conductive resin layer is,
• the moisture-proof resin portion includes a first portion, a second portion, and a third portion, the first portion being a portion between the first substrate and the film, the second portion being a portion between the second substrate and the film, the third portion being a portion on an opposite surface, of the film, facing away from a surface on which the anisotropic conductive resin layer is formed, and
• the first portion, the second portion, and the third portion are formed continuously.