H05K 3/306
With lead-in-hole components
Official title: with lead-in-hole components (H05K3/32 takes precedence)
H05K3/306 (With lead-in-hole components) appears on 1,218 US grants and 857 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,218
- Published applications
- 857
- Assignees
- 569
- Inventors
- 2,416
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 5 | 0 |
| 1978 | 14 | 0 |
| 1979 | 9 | 0 |
| 1980 | 11 | 0 |
| 1981 | 11 | 0 |
| 1982 | 11 | 0 |
| 1983 | 11 | 0 |
| 1984 | 13 | 0 |
| 1985 | 18 | 0 |
| 1986 | 14 | 0 |
| 1987 | 15 | 0 |
| 1988 | 18 | 0 |
| 1989 | 17 | 0 |
| 1990 | 26 | 0 |
| 1991 | 25 | 0 |
| 1992 | 24 | 0 |
| 1993 | 17 | 0 |
| 1994 | 19 | 0 |
| 1995 | 21 | 0 |
| 1996 | 17 | 0 |
| 1997 | 27 | 0 |
| 1998 | 36 | 0 |
| 1999 | 42 | 0 |
| 2000 | 35 | 0 |
| 2001 | 37 | 12 |
| 2002 | 38 | 31 |
| 2003 | 34 | 38 |
| 2004 | 37 | 37 |
| 2005 | 21 | 40 |
| 2006 | 34 | 37 |
| 2007 | 30 | 41 |
| 2008 | 25 | 49 |
| 2009 | 32 | 50 |
| 2010 | 34 | 43 |
| 2011 | 29 | 36 |
| 2012 | 27 | 30 |
| 2013 | 29 | 26 |
| 2014 | 20 | 39 |
| 2015 | 21 | 35 |
| 2016 | 32 | 26 |
| 2017 | 33 | 22 |
| 2018 | 31 | 32 |
| 2019 | 26 | 41 |
| 2020 | 34 | 35 |
| 2021 | 22 | 49 |
| 2022 | 31 | 22 |
| 2023 | 35 | 29 |
| 2024 | 35 | 27 |
| 2025 | 23 | 14 |
| 2026 | 7 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Press-in machine for pressing components into a substrate, in particular into a printed circuit board or carrier plate, with substrate positioning11 Aug 2026US 12,707,617 B2ERSA GmbH
- Disk device with FPC and chip28 Jul 2026US 12,694,896 B2Kabushiki Kaisha Toshiba
- Methods of manufacture of multi-diameter female contacts with a circuit board30 Jun 2026US 12,672,242 B2Eagle Technology, LLC
- Current sensing device12 May 2026US 12,625,167 B2ABB Schweiz AG
- Half-bridge switch arrangement12 May 2026US 12,628,303 B2SEG Automotive Germany GmbH
- Electronic device with multi-diameter female contacts and related methods1 Oct 2026US 2026/0304640 A1Eagle Technology, LLC
- Printed Circuit Board and Battery System Using the Same13 Aug 2026US 2026/0238022 A1LG Energy Solution, Ltd.
- Sensor module and sensor device30 Jul 2026US 2026/0219073 A1SMC Corporation
- Press-fit terminal and connection structure of press-fit terminal18 Jun 2026US 2026/0171693 A1Sumitomo Wiring Systems, Ltd.
- Electrical Connector with Alignment and Retention Pins18 Jun 2026US 2026/0171695 A1TE Connectivity Solutions GmbH
Most cited
By later US patents
- Sockets for electronic components and methods of connecting to electronic components453US 5,772,451 AForm Factor, Inc. · 1998
- Method of manufacturing electrical contacts, using a sacrificial member437US 5,476,211 AForm Factor, Inc. · 1995
- Method of planarizing tips of probe elements of a probe card assembly397US 5,974,662 AFormFactor, Inc. · 1999
- Flexible contact structure with an electrically conductive shell340US 5,917,707 AFormFactor, Inc. · 1999
- Method of fabricating an interconnection element335US 6,336,269 B12002