H05K 3/303
With surface mounted components
Official title: with surface mounted components (H05K3/32 takes precedence)
H05K3/303 (With surface mounted components) appears on 2,347 US grants and 2,178 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,347
- Published applications
- 2,178
- Assignees
- 996
- Inventors
- 5,085
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 6 | 0 |
| 1979 | 6 | 0 |
| 1980 | 7 | 0 |
| 1981 | 6 | 0 |
| 1982 | 9 | 0 |
| 1983 | 8 | 0 |
| 1984 | 8 | 0 |
| 1985 | 9 | 0 |
| 1986 | 15 | 0 |
| 1987 | 15 | 0 |
| 1988 | 19 | 0 |
| 1989 | 28 | 0 |
| 1990 | 16 | 0 |
| 1991 | 32 | 0 |
| 1992 | 24 | 0 |
| 1993 | 20 | 0 |
| 1994 | 35 | 0 |
| 1995 | 31 | 0 |
| 1996 | 40 | 0 |
| 1997 | 50 | 0 |
| 1998 | 46 | 0 |
| 1999 | 48 | 0 |
| 2000 | 57 | 0 |
| 2001 | 54 | 22 |
| 2002 | 66 | 70 |
| 2003 | 64 | 75 |
| 2004 | 55 | 91 |
| 2005 | 59 | 83 |
| 2006 | 59 | 87 |
| 2007 | 59 | 100 |
| 2008 | 45 | 113 |
| 2009 | 52 | 122 |
| 2010 | 67 | 94 |
| 2011 | 78 | 78 |
| 2012 | 73 | 59 |
| 2013 | 60 | 69 |
| 2014 | 55 | 84 |
| 2015 | 63 | 124 |
| 2016 | 74 | 92 |
| 2017 | 97 | 89 |
| 2018 | 96 | 108 |
| 2019 | 100 | 93 |
| 2020 | 119 | 118 |
| 2021 | 96 | 88 |
| 2022 | 86 | 83 |
| 2023 | 75 | 77 |
| 2024 | 66 | 63 |
| 2025 | 55 | 49 |
| 2026 | 33 | 47 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Connection structure for yarn wire and circuit board15 Sep 2026US 12,739,980 B2Makalot Industrial Co., Ltd.
- Inspection device, mounting apparatus, inspection method, and non-transitory computer readable recording medium8 Sep 2026US 12,733,455 B2Yamaha Robotics Co., Ltd.
- Electronic device and manufacturing method thereof1 Sep 2026US 12,727,093 B2Innolux Corporation
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Memory device with emi shield1 Oct 2026US 2026/0304600 A1Micron Technology, Inc.
- Integrated cooling assembly with upper and lower channels10 Sep 2026US 2026/0271225 A1Adeia Semiconductor Bonding Technologies Inc.
- Manufacturing management system for electronic apparatus and method for manufacturing electronic apparatus10 Sep 2026US 2026/0271257 A1Seiko Epson Corporation
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Method for manufacturing circuit board, apparatus for packaging circuit board, and electronic apparatus27 Aug 2026US 2026/0255497 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Semiconductor device in a resin package housed in a frame having high thermal conductivity660US 5,625,222 AFujitsu Limited · 1997
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Chip connection structure having diret through-hole connections through adhesive film and wiring substrate332US 5,870,289 AHitachi, Ltd. · 1999
- Integrated circuit package and method of fabrication317US 6,028,365 AMicron Technology, Inc. · 2000
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000