H05K 3/305
Affixing by adhesive
Official title: {Affixing by adhesive}
H05K3/305 (Affixing by adhesive) appears on 1,091 US grants and 1,015 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,091
- Published applications
- 1,015
- Assignees
- 524
- Inventors
- 2,490
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 6 | 0 |
| 1979 | 6 | 0 |
| 1980 | 5 | 0 |
| 1981 | 4 | 0 |
| 1982 | 8 | 0 |
| 1983 | 7 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 11 | 0 |
| 1987 | 9 | 0 |
| 1988 | 12 | 0 |
| 1989 | 18 | 0 |
| 1990 | 8 | 0 |
| 1991 | 18 | 0 |
| 1992 | 10 | 0 |
| 1993 | 10 | 0 |
| 1994 | 20 | 0 |
| 1995 | 18 | 0 |
| 1996 | 10 | 0 |
| 1997 | 22 | 0 |
| 1998 | 22 | 0 |
| 1999 | 24 | 0 |
| 2000 | 26 | 0 |
| 2001 | 26 | 6 |
| 2002 | 39 | 36 |
| 2003 | 28 | 37 |
| 2004 | 24 | 44 |
| 2005 | 28 | 48 |
| 2006 | 28 | 47 |
| 2007 | 32 | 58 |
| 2008 | 28 | 68 |
| 2009 | 30 | 71 |
| 2010 | 34 | 54 |
| 2011 | 50 | 55 |
| 2012 | 38 | 36 |
| 2013 | 32 | 29 |
| 2014 | 36 | 31 |
| 2015 | 26 | 57 |
| 2016 | 28 | 42 |
| 2017 | 46 | 29 |
| 2018 | 26 | 32 |
| 2019 | 32 | 29 |
| 2020 | 38 | 40 |
| 2021 | 29 | 38 |
| 2022 | 28 | 35 |
| 2023 | 25 | 30 |
| 2024 | 27 | 31 |
| 2025 | 23 | 11 |
| 2026 | 20 | 21 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Connection structure for yarn wire and circuit board15 Sep 2026US 12,739,980 B2Makalot Industrial Co., Ltd.
- Camera module packaging structure and electronic device having the same18 Aug 2026US 12,713,521 B2Triple Win Technology(Shenzhen) Co. Ltd.
- Method for placing a chip for device manufacturing28 Jul 2026US 12,696,398 B2Ciena Corporation
- Method for manufacturing wiring board14 Jul 2026US 12,684,697 B2Fujikura Printed Circuits Ltd.
- Integrated cooling assembly with upper and lower channels10 Sep 2026US 2026/0271225 A1Adeia Semiconductor Bonding Technologies Inc.
- Circuit board, semiconductor device, and method for manufacturing semiconductor device27 Aug 2026US 2026/0255471 A1Kioxia Corporation
- Welding-type systems using fluid sensors with bond resisting substances27 Aug 2026US 2026/0255500 A1Illinois Tool Works Inc.
- Surface mount technology using supporting member2 Jul 2026US 2026/0191092 A1Lenovo (Beijing) Limited
- Vehicular camera assembly with pcb adhered to lens holder25 Jun 2026US 2026/0181788 A1Magna Electronics Inc.
Most cited
By later US patents
- Integrated circuit package and method of fabrication317US 6,028,365 AMicron Technology, Inc. · 2000
- Multichip module for surface mounting on printed circuit boards281US 6,154,372 ASiemens Aktiengesellschaft · 2000
- Flip chip technology using electrically conductive polymers and dielectrics219US 5,074,947 AEpoxy Technology, Inc. · 1991
- Flip chip bonding method using electrically conductive polymer bumps194US 5,196,371 AEpoxy Technology, Inc. · 1993
- Flexible touchpad sensor grid for conforming to arcuate surfaces183US 6,680,731 B2Cirque Corporation · 2004