Method for placing a chip for device manufacturing

A method for placing a chip for device manufacturing, the method comprising:

• picking up the chip with a component placement tool comprising a tool surface;
• spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising
• beginning the spatially translating at a first spatial coordinate with respect to the direction, and
• ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction;
• and
• in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction;
• wherein the sensor detects contact between the reference surface and the tool surface by at least one of (1) detecting a change in mechanical force, (2) detecting a change in air pressure in a portion of the component placement tool, or (3) detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface;
• and
• wherein the sensor detects contact between the reference surface and the tool surface by detecting a change in mechanical force.

A method for placing a chip for device manufacturing, the method comprising:

• picking up the chip with a component placement tool comprising a tool surface;
• spatially translating the component placement tool and the chip along a direction substantially perpendicular to a plane defined by a reference surface, the spatially translating comprising
• beginning the spatially translating at a first spatial coordinate with respect to the direction, and
• ending the spatially translating when contact between the reference surface and the tool surface is detected by a sensor at a second spatial coordinate with respect to the direction;
• and
• in response to detecting the contact, releasing the chip from the component placement tool and onto a portion of a device assembly in proximity to the second spatial coordinate with respect to the direction;
• wherein the sensor detects contact between the reference surface and the tool surface by at least one of (1) detecting a change in mechanical force, (2) detecting a change in air pressure in a portion of the component placement tool, or (3) detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface;
• and
• wherein the sensor detects contact between the reference surface and the tool surface by detecting a change in an electrical connection caused by the contact between the reference surface and the tool surface.