Surface mount technology using supporting member

Abstract

A method of fabricating an electronic assembly (100,400) includes: forming a supporting member (130,430) by applying a first adhesive layer (133,433) to an interior surface of a supporting frame (131,431) and a second adhesive layer (134,434) to a bottom surface of the supporting frame (131,431) (S501); attaching, through the first adhesive layer (133,433), the supporting member (130,430) to a component (110,410) comprising a ball grid array of solder balls (111,411) (S502), such that the interior surface of the supporting frame (131,431) covers a portion of a first side surface of the component (110,410) and a portion of the bottom surface of the component (110,410); mounting, through the second adhesive layer (134,434), the supporting member (130,430) to a substrate (120,420) comprising an array of contact pads (121,421) whose pattern matches the ball grid array (S503); and curing the first adhesive layer (133,433) and the second adhesive layer (134,434) and connecting the solder balls (111,411) to the contact pads (121,421) by reflow soldering at a temperature higher than a melting point of the solder balls (111,411) (S504).

Dependencies are inferred from the claim text.