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US 2026/0255500 A1Published application
Welding-type systems using fluid sensors with bond resisting substances
AssigneeIllinois Tool Works Inc.
InventorDavid P. Marcusen
Life of this patent
Estimating the term…
Abstract
The present disclosure contemplates the use of a bond resisting substance (e.g., conductive grease, dry powder, etc.) applied between a bonding sheet and circuit board of a fluid sensor of a welding-type power supply. In some examples, the bond resisting substance prevents unwanted and/or excessive bonding of the bonding sheet to the circuit board, thereby preventing erroneous fluid detections by the fluid sensor.
Claims20
A fluid sensor, comprising:
- a fluid chamber having a fluid inlet through which fluid can enter the fluid chamber, the fluid chamber further having a chamber opening;
- a circuit board positioned adjacent the fluid chamber, the circuit board comprising a switch contact surface positioned in or adjacent the chamber opening of the fluid chamber;
- a bonding sheet connected to the circuit board via an adhesive bond;
- a contact switch disposed on the bonding sheet, the contact switch being brought into electrical contact with the switch contact surface of the circuit board by the adhesive bond between the circuit board and the bonding sheet, the contact switch being positioned in or adjacent the chamber opening of the fluid chamber, the contact switch being configured to deform in response to a fluid pressure within the fluid chamber exceeding a pressure threshold;
- and
- a bond resisting substance positioned between the circuit board and the bonding sheet proximate the switch contact surface, the bond resisting substance resisting the adhesive bond between the circuit board and the bonding sheet proximate the switch contact surface, thereby stopping the adhesive bond between the circuit board and the bonding sheet from preventing reversion of the contact switch to an undeformed state after the fluid pressure within the fluid chamber no longer exceeds the pressure threshold.
3 more elements
A method of manufacturing a fluid sensor, comprising:
- adhesively bonding a circuit board to a bonding sheet, the circuit board comprising a switch contact surface, and the bonding sheet comprising a contact switch that is brought into electrical contact with the switch contact surface of the circuit board by adhesively bonding the circuit board to the bonding sheet, the contact switch being configured to deform in response to a pressure exerted against the contact switch exceeding a pressure threshold;
- applying a bond resisting substance between the circuit board and the bonding sheet prior to adhesively bonding the circuit board to the bonding sheet, the bond resisting substance resisting an adhesive bond between the circuit board and the bonding sheet proximate the switch contact surface, thereby stopping the adhesive bond between the circuit board and the bonding sheet from preventing reversion of the contact switch to an undeformed state after the pressure exerted against the contact switch no longer exceeds the pressure threshold;
- and
- connecting the circuit board to a fluid chamber such that the contact switch and switch contact surface are positioned in or adjacent a chamber opening of the fluid chamber, the fluid chamber having a fluid inlet through which fluid can enter the fluid chamber and exert the pressure against the contact switch.
1 more element
Dependencies are inferred from the claim text.