US 12,727,093 B2Granted

Electronic device and manufacturing method thereof

AssigneeInnolux Corporation

InventorChun-Hsien Lin

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Abstract

An electronic device is provided, the electronic device includes a driving substrate, the driving substrate includes a plurality of first grooves and a plurality of second grooves, the first grooves and the second grooves have different sizes, at least one first electronic component of the plurality of first electronic components is disposed in one of the plurality of first grooves, at least one second electronic component of the plurality of second electronic components is disposed in one of the plurality of second grooves, a maximum length passing through a center of a bottom surface of the at least one first electronic component is defined as L1, a bottom length of one side of at least one second groove among the second grooves is defined as L2, and the at least one first electronic component and the at least one second groove satisfy the condition of L1>L2.

Claims4

Dependent claims

An electronic device comprising:

a substrate;
an insulating layer disposed on the substrate, wherein the insulating layer comprises a plurality of first grooves concaving toward the substrate and a plurality of second grooves concaving toward the substrate, and the first grooves and the second grooves have different shapes;
a plurality of first light emitting diodes, wherein at least one first light emitting diode of the plurality of first light emitting diodes is disposed in one of the plurality of first grooves;
a plurality of second light emitting diodes, wherein at least one second light emitting diode of the plurality of second light emitting diodes is disposed in one of the plurality of second grooves;
wherein a maximum length passing through a center of a bottom surface of the at least one first light emitting diode is defined as L1, a bottom length of one side of at least one second groove among the second grooves is defined as L2, and the at least one first light emitting diode and the at least one second groove satisfy the condition of L1>L2.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/120,987Filed 13 Mar 2023 · continuation
Priority: CN 202011186128.329 Oct 2020
Published: US 2023/0232542 A120 Jul 2023
Granted: 1 Sep 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H05K 3/303
Assembling printed circuits with electric components, e.g. with resistors: with surface mounted components
H05K 1/181
Structurally associated with non-printed electric components: associated with surface mounted components
H10H 20/01
Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]: manufacture or treatment
H10H 20/821
Characterised by their shape, e.g. curved or truncated substrates: of the light-emitting regions, e.g. non-planar junctions

Family

Application17/507,756Parent of this continuation · filed 21 Oct 2021
US 2023/0232542 A1Pre-grant publication · published 20 Jul 2023
US 11,627,666 B2Parent of this continuation
US 2022/0141964 A1Published application
US 12,727,093 B2This patent

From the US filing history. Foreign family members aren’t listed.