H05K 3/38
Improvement of the adhesion between the insulating substrate and the metal
H05K3/38 (Improvement of the adhesion between the insulating substrate and the metal) appears on 3,839 US grants and 3,216 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,839
- Published applications
- 3,216
- Assignees
- 1,244
- Inventors
- 8,097
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 40 | 0 |
| 1977 | 25 | 0 |
| 1978 | 32 | 0 |
| 1979 | 12 | 0 |
| 1980 | 16 | 0 |
| 1981 | 26 | 0 |
| 1982 | 43 | 0 |
| 1983 | 30 | 0 |
| 1984 | 49 | 0 |
| 1985 | 44 | 0 |
| 1986 | 56 | 0 |
| 1987 | 64 | 0 |
| 1988 | 64 | 0 |
| 1989 | 93 | 0 |
| 1990 | 98 | 0 |
| 1991 | 88 | 0 |
| 1992 | 100 | 0 |
| 1993 | 107 | 0 |
| 1994 | 84 | 0 |
| 1995 | 89 | 0 |
| 1996 | 71 | 0 |
| 1997 | 62 | 0 |
| 1998 | 76 | 0 |
| 1999 | 82 | 0 |
| 2000 | 94 | 0 |
| 2001 | 118 | 50 |
| 2002 | 106 | 155 |
| 2003 | 116 | 154 |
| 2004 | 125 | 169 |
| 2005 | 82 | 187 |
| 2006 | 87 | 182 |
| 2007 | 86 | 186 |
| 2008 | 81 | 193 |
| 2009 | 88 | 216 |
| 2010 | 106 | 208 |
| 2011 | 107 | 117 |
| 2012 | 141 | 106 |
| 2013 | 95 | 78 |
| 2014 | 81 | 94 |
| 2015 | 61 | 112 |
| 2016 | 69 | 87 |
| 2017 | 72 | 75 |
| 2018 | 58 | 94 |
| 2019 | 90 | 111 |
| 2020 | 95 | 103 |
| 2021 | 84 | 110 |
| 2022 | 74 | 101 |
| 2023 | 65 | 101 |
| 2024 | 97 | 97 |
| 2025 | 62 | 84 |
| 2026 | 48 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Method for manufacturing circuit board29 Sep 2026US 12,750,948 B2Mitsui Kinzoku Company, Limited
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Wiring board8 Sep 2026US 12,733,092 B2Dai Nippon Printing Co.Ltd.
- Component Carrier With at Least One Opening and Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304618 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Low dielectric resin composition, adhesiveness-imparting agent, low dielectric adhesive composition, low dielectric adhesive molded product, low dielectric adhesive, and laminate3 Sep 2026US 2026/0258237 A1Mitsui Chemicals, Inc.
- Method for producing wiring board27 Aug 2026US 2026/0255472 A1Mitsui Mining & Smelting Co., Ltd.
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Method of forming copper/copper alloy interconnection with reduced electromigration316US 6,242,349 B1Advanced Micro Devices, Inc. · 2001
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997