H05K 3/388
By the use of a metallic or inorganic thin film adhesion layer
Official title: {by the use of a metallic or inorganic thin film adhesion layer}
H05K3/388 (By the use of a metallic or inorganic thin film adhesion layer) appears on 727 US grants and 617 published applications in this corpus.
Search patents in H05K- Granted patents
- 727
- Published applications
- 617
- Assignees
- 342
- Inventors
- 1,798
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 5 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 8 | 0 |
| 1983 | 9 | 0 |
| 1984 | 9 | 0 |
| 1985 | 4 | 0 |
| 1986 | 7 | 0 |
| 1987 | 10 | 0 |
| 1988 | 7 | 0 |
| 1989 | 17 | 0 |
| 1990 | 15 | 0 |
| 1991 | 15 | 0 |
| 1992 | 22 | 0 |
| 1993 | 22 | 0 |
| 1994 | 15 | 0 |
| 1995 | 18 | 0 |
| 1996 | 14 | 0 |
| 1997 | 15 | 0 |
| 1998 | 11 | 0 |
| 1999 | 11 | 0 |
| 2000 | 18 | 0 |
| 2001 | 28 | 10 |
| 2002 | 26 | 36 |
| 2003 | 15 | 30 |
| 2004 | 26 | 22 |
| 2005 | 9 | 31 |
| 2006 | 11 | 36 |
| 2007 | 13 | 28 |
| 2008 | 12 | 43 |
| 2009 | 16 | 35 |
| 2010 | 16 | 33 |
| 2011 | 19 | 26 |
| 2012 | 30 | 22 |
| 2013 | 26 | 15 |
| 2014 | 16 | 12 |
| 2015 | 14 | 22 |
| 2016 | 16 | 20 |
| 2017 | 14 | 12 |
| 2018 | 12 | 13 |
| 2019 | 14 | 19 |
| 2020 | 17 | 22 |
| 2021 | 21 | 24 |
| 2022 | 12 | 32 |
| 2023 | 19 | 24 |
| 2024 | 30 | 23 |
| 2025 | 15 | 14 |
| 2026 | 12 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Metal-coated substrates, interposers, and methods for production thereof25 Aug 2026US 12,720,675 B2Kuprion Inc.
- Liquid metal circuits and methods of making the same18 Aug 2026US 12,713,523 B2Carnegie Mellon University
- Flexible printed circuit board with near-field communication (NFC) coil integration9 Jun 2026US 12,651,831 B2Meta Platforms Technologies, LLC
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Metal-ceramic substrate and process for producing a metal-ceramic substrate20 Aug 2026US 2026/0242289 A1
- Method for forming an adhesion buffer layer on the walls of high aspect ratio through-holes of an insulating substrate16 Jul 2026US 2026/0206147 A1Ming Chi University of Technology
- Circuit board and chip package comprising same2 Jul 2026US 2026/0190224 A1LG Innotek Co., Ltd.
- Method of manufacturing flexible copper clad laminated film having ptfe substrate25 Jun 2026US 2026/0176743 A1Cit, S.A.
- Printed wiring board28 May 2026US 2026/0150187 A1Sumitomo Electric Industries, Ltd.
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Method of forming copper/copper alloy interconnection with reduced electromigration316US 6,242,349 B1Advanced Micro Devices, Inc. · 2001
- Method of electroless plating copper on nitride barrier297US 6,436,816 B1Industrial Technology Research Institute · 2002
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999