Method of manufacturing flexible copper clad laminated film having ptfe substrate
AssigneeCit, S.A.
InventorsSeung JEONG, Se Young JEONG, You Sil LEE
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Abstract
The present invention relates to a method of manufacturing a flexible copper clad laminated film having a polytetrafluoroethylene (PTFE) substrate. More specifically, the present invention relates to a method of manufacturing a flexible copper clad laminated (FCCL) film having a polytetrafluoroethylene (PTFE) substrate, in which a metal thin film is uniformly deposited on the polytetrafluoroethylene (PTFE) substrate to manufacture a flexible copper clad laminated (FCCL) film, which can improve the electrical performance of the flexible copper clad laminated film and avoid the property degradation of the polytetrafluoroethylene (PTFE) substrate.
Claims10
A method of manufacturing a PTFE-based flexible copper clad laminated substrate, the method comprising:
- a polytetrafluoroethylene (PTFE) substrate preparation step, wherein a substrate made of a polytetrafluoroethylene (PTFE) material is prepared in a chamber space of a vacuum chamber;
- a reaction gas injection step, wherein a reaction gas is injected after the chamber space of the vacuum chamber is formed with a vacuum for a sputtering process;
- a high frequency power application step, wherein high frequency power is applied to a target mounted on an inner upper portion of the vacuum chamber and made of single crystal metal particles;
- and
- a metal thin film lamination step, wherein metal particles separated from the target by the applied high frequency power are deposited on top of the polytetrafluoroethylene (PTFE) substrate to form a metal thin film.
Dependencies are inferred from the claim text.