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US 2026/0242289 A1Published application
Metal-ceramic substrate and process for producing a metal-ceramic substrate
OwnerStefan Britting, Karsten Schmidtinventors
Life of this patent
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Abstract
Metal-ceramic substrate that can be used as a printed circuit board, comprising a ceramic element and at least one component metallisation, which is bonded to the ceramic element, wherein the component metallisation is structured in order to form conductor paths, wherein the ceramic element comprises magnesium oxide and wherein a proportion of magnesium oxide is greater than 60 wt %, preferably greater than 80% and more preferably greater than 95 wt %.
Claims14
1-15. (canceled)
A metal-ceramic substrate (1), which can be used as a circuit board, comprising a ceramic element (30) and
- at least one component metallisation (10), which is bonded to the ceramic element (30), wherein the at least one component metallisation (10) is structured to form conductor tracks,
- wherein the ceramic element (30) comprises magnesium oxide and wherein a proportion of magnesium oxide in the ceramic element is greater than 60 wt %, wherein the magnesium oxide-comprising ceramic element (30) is doped with an accompanying material, characterized in that the accompanying material is selected such that it leads to a deviation in the thermal conductivity, which is less than 20% of the thermal conductivity of the magnesium oxide.
Dependencies are inferred from the claim text.