H05K 3/381
By special treatment of the substrate
Official title: {by special treatment of the substrate}
H05K3/381 (By special treatment of the substrate) appears on 701 US grants and 556 published applications in this corpus.
Search patents in H05K- Granted patents
- 701
- Published applications
- 556
- Assignees
- 360
- Inventors
- 1,714
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 10 | 0 |
| 1977 | 7 | 0 |
| 1978 | 10 | 0 |
| 1979 | 4 | 0 |
| 1980 | 3 | 0 |
| 1981 | 9 | 0 |
| 1982 | 15 | 0 |
| 1983 | 8 | 0 |
| 1984 | 11 | 0 |
| 1985 | 14 | 0 |
| 1986 | 14 | 0 |
| 1987 | 10 | 0 |
| 1988 | 17 | 0 |
| 1989 | 31 | 0 |
| 1990 | 29 | 0 |
| 1991 | 14 | 0 |
| 1992 | 16 | 0 |
| 1993 | 24 | 0 |
| 1994 | 12 | 0 |
| 1995 | 17 | 0 |
| 1996 | 11 | 0 |
| 1997 | 9 | 0 |
| 1998 | 7 | 0 |
| 1999 | 15 | 0 |
| 2000 | 16 | 0 |
| 2001 | 21 | 10 |
| 2002 | 11 | 21 |
| 2003 | 17 | 23 |
| 2004 | 21 | 29 |
| 2005 | 8 | 30 |
| 2006 | 10 | 35 |
| 2007 | 13 | 30 |
| 2008 | 7 | 28 |
| 2009 | 13 | 31 |
| 2010 | 17 | 30 |
| 2011 | 15 | 29 |
| 2012 | 25 | 24 |
| 2013 | 17 | 21 |
| 2014 | 18 | 18 |
| 2015 | 7 | 29 |
| 2016 | 10 | 14 |
| 2017 | 20 | 20 |
| 2018 | 15 | 20 |
| 2019 | 19 | 23 |
| 2020 | 15 | 16 |
| 2021 | 17 | 14 |
| 2022 | 14 | 16 |
| 2023 | 7 | 15 |
| 2024 | 13 | 15 |
| 2025 | 11 | 8 |
| 2026 | 7 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Insulating circuit board and semiconductor device using same25 Aug 2026US 12,721,197 B2Niterra Materials Co., Ltd.
- Structure body and wiring board4 Aug 2026US 12,701,655 B2Taiyo Holdings Co., Ltd.
- Method of making an interconnect substrate14 Apr 2026US 12,604,395 B2Shinko Electric Industries Co., Ltd.
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Electronic device including outer housing plated with conductive member and manufacturing method therefor3 Feb 2026US 12,540,402 B2Intops Co., Ltd.
- Component Carrier With at Least One Opening and Method of Manufacturing a Component Carrier1 Oct 2026US 2026/0304618 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Resin film, metal-clad laminate, printed wiring board, and method for producing resin film13 Aug 2026US 2026/0233497 A1The University of Osaka
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring board and wiring board manufacturing method9 Jul 2026US 2026/0197940 A1Shinko Electric Industries Co., Ltd.
- Stretchable substrate, stretchable device, and method for producing same21 May 2026US 2026/0143585 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995
- Noble metal-polymer composites and flexible thin-film conductors prepared therefrom156US 5,178,957 AMinnesota Mining and Manufacturing Company · 1993
- Process for manufacturing a printed wiring board107US 6,775,907 B1International Business Machines Corporation · 2004
- Method of metallizing ceramic material100US 4,795,658 AMurata Manufacturing Co., Ltd. · 1989
- Multilayer printed wiring board and method of manufacturing multilayer printed wiring board90US 6,828,510 B1Ibiden Co., Ltd. · 2004