Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
AssigneeIbiden Co., Ltd.
InventorsMotoo Asai, Dongdong Wang, Takahiro Mori
Life of this patent
Estimating the term…
Abstract
A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.
Claims21
A multi-layer printed circuit board comprising:
- a core substrate incorporating a metal layer sandwiched by resins having a core member, said resins having non-penetrating openings filled with metal to flatten the core substrate;
- and
- an interlayer resin insulating layer built up on said core substrate.
A multi-layer printed circuit board comprising:
- an interlayer resin insulating layer built up on a core substrate, wherein
- said core substrate is constituted by sandwiching a metal layer between two resin layers each of said resin layers having a core member, and each of two non-penetrating openings which are formed in said resin, which reach said metal layer, said non-penetrating openings are provided on an upper side and a lower side of said metal layer so that through holes are formed,
- wherein a conductor comprising metal filled within the non-penetrating openings is formed to flatten the core substrate.
A method of manufacturing a multi-layer printed circuit board comprising at least the following steps (A) to (C):
- (A) forming a resin insulating layer having a core member on an upper layer of a resin insulating layer having a core member having an upper surface on which a metal layer is formed so that a core substrate is formed;
- (B) forming non-penetrating openings in said resin insulating layer of said core substrate by applying laser beams such that said non-penetrating openings reach said metal layer, on an upper side and a lower side of said metal layer;
- and
- (C) filling a conductor within each non-penetrating opening to flatten the core substrate formed in said resin insulating layer so that through holes are formed.
A method of manufacturing a multi-layer printed circuit board comprising at least the following steps (A) to (D):
- (A) etching a metal layer of a one-side metal-clad resin having a core member to form a circuit pattern;
- (B) laminating a resin film to the surface of said circuit pattern to constitute a core substrate;
- (C) forming non-penetrating openings in a resin insulating layer of said core substrate by applying laser beams such that said non-penetrating openings reach said circuit pattern, on an upper side and a lower side of said circuit pattern;
- and
- (D) filling a conductor within each non-penetrating opening of said resin insulating layer to flatten the core substrate to form through holes.
A method of manufacturing a multi-layer printed circuit board comprising at least the following steps (A) to (E):
- (A) etching a metal layer of a one-side metal-clad resin having a core member to form a circuit pattern;
- (B) coating the surface of said circuit pattern with resin and polishing said circuit pattern so that said circuit pattern is flattened;
- (C) laminating a resin film to the surface of said circuit pattern to constitute a core substrate;
- (D) forming non-penetrating openings in a resin insulating layer of said core substrate by applying laser beams such that said non-penetrating openings reach said circuit pattern, on an upper side and a lower side of said circuit pattern;
- and
- (E) filling a conductor within each non-penetrating opening of said resin insulating layer to flatten the core substrate to form through holes.
Dependencies are inferred from the claim text.