H05K 3/382
By special treatment of the metal
Official title: {by special treatment of the metal}
H05K3/382 (By special treatment of the metal) appears on 947 US grants and 750 published applications in this corpus.
Search patents in H05K- Granted patents
- 947
- Published applications
- 750
- Assignees
- 341
- Inventors
- 1,835
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 5 | 0 |
| 1978 | 7 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 2 | 0 |
| 1982 | 6 | 0 |
| 1983 | 6 | 0 |
| 1984 | 12 | 0 |
| 1985 | 11 | 0 |
| 1986 | 11 | 0 |
| 1987 | 12 | 0 |
| 1988 | 13 | 0 |
| 1989 | 13 | 0 |
| 1990 | 21 | 0 |
| 1991 | 20 | 0 |
| 1992 | 12 | 0 |
| 1993 | 23 | 0 |
| 1994 | 17 | 0 |
| 1995 | 28 | 0 |
| 1996 | 22 | 0 |
| 1997 | 10 | 0 |
| 1998 | 24 | 0 |
| 1999 | 20 | 0 |
| 2000 | 19 | 0 |
| 2001 | 25 | 14 |
| 2002 | 32 | 32 |
| 2003 | 41 | 36 |
| 2004 | 32 | 60 |
| 2005 | 28 | 47 |
| 2006 | 31 | 39 |
| 2007 | 27 | 41 |
| 2008 | 30 | 51 |
| 2009 | 26 | 50 |
| 2010 | 31 | 40 |
| 2011 | 35 | 23 |
| 2012 | 33 | 32 |
| 2013 | 28 | 18 |
| 2014 | 27 | 20 |
| 2015 | 14 | 30 |
| 2016 | 15 | 21 |
| 2017 | 16 | 13 |
| 2018 | 14 | 21 |
| 2019 | 17 | 19 |
| 2020 | 24 | 27 |
| 2021 | 13 | 26 |
| 2022 | 18 | 18 |
| 2023 | 12 | 22 |
| 2024 | 22 | 21 |
| 2025 | 15 | 21 |
| 2026 | 12 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Surface-treated copper foil, and copper-clad laminate and printed wiring board including the surface-treated copper foil8 Sep 2026US 12,729,451 B2Fukuda Metal Foil & Powder Co., Ltd.
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Roughening solution for rolled copper foil and method for producing roughened copper foil19 May 2026US 12,630,931 B2Mitsubishi Gas Chemical Company, Inc.
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Wiring board and wiring board manufacturing method9 Jul 2026US 2026/0197940 A1Shinko Electric Industries Co., Ltd.
- Circuit board, method for manufacturing circuit board, and electronic device25 Jun 2026US 2026/0182474 A1Fict Limited
- Motor controller potting shield30 Apr 2026US 2026/0121492 A1Nidec Motor Corporation
- Surface-treated copper foil16 Apr 2026US 2026/0107381 A1Dupont Electronics, Inc.
- Aqueous composition, stainless steel surface roughening method using same, and method for manufacturing roughened stainless steel19 Mar 2026US 2026/0078497 A1Mitsubishi Gas Chemical Company, Inc.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Laser system and method for single press micromachining of multilayer workpieces267US 6,407,363 B2Electro Scientific Industries, Inc. · 2002
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Printed wiring board having highly reliably via hole and process for forming via hole129US 6,280,641 B1Mitsubishi Gas Chemical Company, Inc. · 2001