H05K 3/385
By conversion of the surface of the metal
Official title: {by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer}
H05K3/385 (By conversion of the surface of the metal) appears on 214 US grants and 137 published applications in this corpus.
Search patents in H05K- Granted patents
- 214
- Published applications
- 137
- Assignees
- 103
- Inventors
- 464
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 5 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 5 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 4 | 0 |
| 1995 | 9 | 0 |
| 1996 | 8 | 0 |
| 1997 | 3 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 2 |
| 2002 | 7 | 4 |
| 2003 | 8 | 8 |
| 2004 | 10 | 9 |
| 2005 | 5 | 11 |
| 2006 | 5 | 4 |
| 2007 | 4 | 5 |
| 2008 | 5 | 11 |
| 2009 | 7 | 12 |
| 2010 | 4 | 5 |
| 2011 | 10 | 10 |
| 2012 | 7 | 6 |
| 2013 | 3 | 1 |
| 2014 | 8 | 5 |
| 2015 | 2 | 8 |
| 2016 | 4 | 4 |
| 2017 | 5 | 3 |
| 2018 | 2 | 7 |
| 2019 | 6 | 2 |
| 2020 | 5 | 5 |
| 2021 | 1 | 1 |
| 2022 | 0 | 2 |
| 2023 | 3 | 6 |
| 2024 | 3 | 3 |
| 2025 | 3 | 3 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transparent circuit board9 Jun 2026US 12,652,761 B2Avary Holding (Shenzhen) Co., Limited.
- Composite copper components17 Jun 2025US 12,336,116 B2Namics Corporation
- Composite structure and manufacturing method thereof6 May 2025US 12,291,605 B2DIC Corporation
- Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate22 Apr 2025US 12,284,766 B2BYD Company Limited
- Metal surface treatment liquid and liquid concentrate thereof, metal surface treatment liquid set, metal surface treatment method, and method for manufacturing printed wiring board17 Sep 2024US 12,091,430 B2Shikoku Chemicals Corporation
- Circuit board3 Jul 2025US 2025/0220810 A1LG Innotek Co., Ltd.
- Triazole compound, method for synthesizing said triazole compound, coupling agent and uses thereof26 Jun 2025US 2025/0206764 A1Shikoku Chemicals Corporation
- Composite film, rigid flexible printed circuit board, and electronic device including same3 Apr 2025US 2025/0113442 A1Samsung Electronics Co., Ltd.
- Transparent circuit board13 Jun 2024US 2024/0196541 A1Avary Holding (Shenzhen) Co., Limited.
- Modified copper surface, heteroaromatic silane compounds and their usage for increasing adhesion strength between copper and an organic material and reducing halo and wedge void formation30 May 2024US 2024/0179851 A1Atotech Deutschland GmbH
Most cited
By later US patents
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Printed wiring board having highly reliably via hole and process for forming via hole129US 6,280,641 B1Mitsubishi Gas Chemical Company, Inc. · 2001
- Multilayer printed wiring board and method of manufacturing multilayer printed wiring board90US 6,828,510 B1Ibiden Co., Ltd. · 2004
- Method of bonding copper and resin81US 4,642,161 AHitachi, Ltd. · 1987
- Capacitive PCB with internal capacitive laminate77US 5,870,274 AHadco Santa Clara, Inc. · 1999