H05K 3/384
By plating
Official title: {by plating}
H05K3/384 (By plating) appears on 412 US grants and 339 published applications in this corpus.
Search patents in H05K- Granted patents
- 412
- Published applications
- 339
- Assignees
- 169
- Inventors
- 792
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 3 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 7 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 6 | 0 |
| 1988 | 7 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 8 | 0 |
| 1992 | 3 | 0 |
| 1993 | 9 | 0 |
| 1994 | 9 | 0 |
| 1995 | 12 | 0 |
| 1996 | 9 | 0 |
| 1997 | 4 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 9 | 0 |
| 2001 | 14 | 11 |
| 2002 | 20 | 17 |
| 2003 | 21 | 15 |
| 2004 | 11 | 29 |
| 2005 | 12 | 13 |
| 2006 | 14 | 13 |
| 2007 | 13 | 25 |
| 2008 | 12 | 18 |
| 2009 | 11 | 27 |
| 2010 | 15 | 12 |
| 2011 | 16 | 11 |
| 2012 | 11 | 13 |
| 2013 | 10 | 9 |
| 2014 | 9 | 7 |
| 2015 | 7 | 7 |
| 2016 | 2 | 10 |
| 2017 | 6 | 3 |
| 2018 | 6 | 8 |
| 2019 | 3 | 7 |
| 2020 | 11 | 14 |
| 2021 | 8 | 22 |
| 2022 | 14 | 8 |
| 2023 | 6 | 13 |
| 2024 | 12 | 13 |
| 2025 | 11 | 12 |
| 2026 | 5 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for integrating a copper-graphene laminate (CGL) in a multilayer PCB fabrication process6 Oct 2026US 12,757,335 B2Bar-Ilan University
- Wiring board, light emitting device, and method for manufacturing thereof7 Apr 2026US 12,598,705 B2Nichia Corporation
- Circuit board3 Mar 2026US 12,568,575 B2LG Innotek Co., Ltd.
- Micro-roughened electrodeposited copper foil and copper clad laminate17 Feb 2026US 12,557,213 B2Co-Tech Development Corp.
- Manufacturing methods for copper-clad laminate and printed wiring board13 Jan 2026US 12,526,929 B2Mitsui Mining & Smelting Co., Ltd.
- Motor controller potting shield30 Apr 2026US 2026/0121492 A1Nidec Motor Corporation
- Surface-treated copper foil having pillar nodule structure, and copper clad laminate and printed wiring board comprising same5 Mar 2026US 2026/0068035 A1Lotte Energy Materials Corporation
- Copper foil for printed circuit boards and manufacturing method thereof27 Nov 2025US 2025/0361641 A1Nan Ya Plastics Corporation
- Copper-clad laminate and uses of the same27 Nov 2025US 2025/0365860 A1Taiwan Union Technology Corporation
- Surface-treated copper foil with heat resistance, and copper clad laminate and printed wiring board including the same27 Nov 2025US 2025/0365863 A1Lotte Energy Materials Corporation
Most cited
By later US patents
- Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition270US 5,380,560 AInternational Business Machines Corporation · 1995
- Laser system and method for single press micromachining of multilayer workpieces267US 6,407,363 B2Electro Scientific Industries, Inc. · 2002
- Solder resist composition and printed circuit boards97US 6,217,987 B1Ibiden Co., Ltd. · 2001
- Thermally conductive, electrically insulative laminate71US 4,810,563 AThe Bergquist Company · 1989
- Multilayer printed wiring board and its production process, resin composition for filling through-hole66US 6,376,052 B1Ibiden Co., Ltd. · 2002