Surface-treated copper foil having pillar nodule structure, and copper clad laminate and printed wiring board comprising same

Abstract

A surface-treated copper foil, which has an excellent adhesive strength with respect to a resin substrate and is suitable for application to a high frequency foil, is disclosed. The present invention provides the surface-treated copper foil comprising a surface-treated side formed by surface treatment of an original foil, the surface-treated copper foil comprising a plurality of nodule structures formed on the surface-treated side, wherein the nodule structures include: a pillar part extending from the surface of the surface-treated copper foil; and a branch part extending from a side or an end portion of the pillar part, wherein the surface roughness (Rz) of the surface-treated side is 1.0 μm or less.

Dependencies are inferred from the claim text.