Manufacturing methods for copper-clad laminate and printed wiring board

A method for manufacturing a copper-clad laminate, comprising:

• providing a surface-treated copper foil comprising a copper foil and a zinc-containing layer provided on at least one surface of the copper foil, and
• affixing a sheet-shaped fluororesin to the zinc-containing layer side of the surface-treated copper foil to obtain a copper-clad laminate,
• wherein the zinc-containing layer is composed of Zn and a transition element M having a melting point of 1200° C. or more, and
• wherein the obtained copper-clad laminate is configured such that when an interface between the copper foil and the zinc-containing layer is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS), the content of Zn at the interface is 2.0% by weight or more and 8.0% by weight or less, and a Zn/M weight ratio, which is a ratio of the content of Zn to the content of the transition element M, is 0.2 or more and 0.6 or less, wherein a depth of the interface between the copper foil and the zinc-containing layer is defined as an inflection point in a curve plotting an amount of Cu as determined via XPS as a function of a depth direction from the zinc-containing layer toward the copper foil.