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US 2026/0107381 A1Published application
Surface-treated copper foil
AssigneeDupont Electronics, Inc.
InventorsSHIH-CHING LIN, TUNG LIN LI
Life of this patent
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Abstract
Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.
Claims6
An surface-treated copper foil, characterized in that the surface-treated copper foil has an electric conductivity of 57.0×106 S/m or more, a cross-sectional average grain size of about 1 μm to about 2.5 μm, a thickness of about 3 μm to about 35 μm;
- and the surface-treated copper foil has at least one treated surface that has a surface roughness (Sz) of 3.0 μm or less, wherein the surface roughness (Sz) is measured at an outermost surface of the surface-treated copper foil according to ISO 25178.
Dependencies are inferred from the claim text.