H05K 3/383
By microetching
Official title: {by microetching}
H05K3/383 (By microetching) appears on 230 US grants and 212 published applications in this corpus.
Search patents in H05K- Granted patents
- 230
- Published applications
- 212
- Assignees
- 126
- Inventors
- 581
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 5 | 0 |
| 1992 | 2 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 9 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 4 | 2 |
| 2002 | 10 | 12 |
| 2003 | 13 | 9 |
| 2004 | 13 | 19 |
| 2005 | 6 | 15 |
| 2006 | 9 | 15 |
| 2007 | 8 | 12 |
| 2008 | 10 | 12 |
| 2009 | 5 | 12 |
| 2010 | 10 | 12 |
| 2011 | 5 | 2 |
| 2012 | 10 | 11 |
| 2013 | 9 | 9 |
| 2014 | 6 | 6 |
| 2015 | 6 | 13 |
| 2016 | 8 | 8 |
| 2017 | 5 | 3 |
| 2018 | 5 | 5 |
| 2019 | 2 | 3 |
| 2020 | 1 | 6 |
| 2021 | 4 | 4 |
| 2022 | 3 | 4 |
| 2023 | 2 | 4 |
| 2024 | 4 | 3 |
| 2025 | 2 | 8 |
| 2026 | 4 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Roughening solution for rolled copper foil and method for producing roughened copper foil19 May 2026US 12,630,931 B2Mitsubishi Gas Chemical Company, Inc.
- Aqueous composition, stainless steel surface roughening method using same, and method for manufacturing roughened stainless steel31 Mar 2026US 12,590,373 B2Mitsubishi Gas Chemical Company, Inc.
- Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for HSIO3 Mar 2026US 12,568,817 B2Intel Corporation
- Micro-roughened electrodeposited copper foil and copper clad laminate17 Feb 2026US 12,557,213 B2Co-Tech Development Corp.
- Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension2 Dec 2025US 12,490,371 B2
- Circuit board, method for manufacturing circuit board, and electronic device25 Jun 2026US 2026/0182474 A1Fict Limited
- Aqueous composition, stainless steel surface roughening method using same, and method for manufacturing roughened stainless steel19 Mar 2026US 2026/0078497 A1Mitsubishi Gas Chemical Company, Inc.
- Wiring substrate and method for manufacturing wiring substrate5 Feb 2026US 2026/0040441 A1Ibiden Co., Ltd.
- Printed wiring board25 Dec 2025US 2025/0393124 A1Ibiden Co., Ltd.
- Circuit board and semiconductor package comprising same23 Oct 2025US 2025/0329622 A1LG Innotek Co., Ltd.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Process for improving the adhesion of polymeric materials to metal surfaces90US 5,869,130 AMac Dermid, Incorporated · 1999
- Surface pretreatment of metals to activate the surface for sol-gel coating70US 5,869,140 AThe Boeing Company · 1999
- Thin-film assembly and method for producing said assembly68US 7,551,454 B2AT&S Austria Technologie & Systemtechnik Aktiengesellschaft · 2009
- Multilayer printed wiring board and its production process, resin composition for filling through-hole66US 6,376,052 B1Ibiden Co., Ltd. · 2002