Wiring substrate and method for manufacturing wiring substrate
AssigneeIbiden Co., Ltd.
InventorKosei OSADA
Life of this patent
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Abstract
A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer, and a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer. The conductor layer includes wirings formed such that the wirings have the minimum wiring width of 3 μm or less and the minimum inter-wiring distance of 3 μm or less and that the conductor layer has mesh-like unevenness formed on a side surface of the conductor layer and not on an upper surface of the conductor layer.
Claims20
A wiring substrate, comprising:
- a first insulating layer;
- a conductor layer formed on the first insulating layer;
- and
- a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer,
- wherein the conductor layer includes a plurality of wirings formed such that the wirings have a minimum wiring width of 3 μm or less and a minimum inter-wiring distance of 3 μm or less and that the conductor layer has mesh-like unevenness formed on a side surface of the conductor layer and not on an upper surface of the conductor layer.
A method for manufacturing a wiring substrate, comprising:
- forming a metal film layer on a first insulating layer;
- forming a resist layer having openings on the metal film layer;
- and
- forming a plating film layer on the metal film layer in the openings formed in the resist layer,
- wherein the forming of the resist layer includes exposing the resist layer by direct imaging exposure such that the openings have mesh-like unevenness formed on side walls of the resist layer in the openings, and the forming of the plating film layer includes forming an uneven shape on a side surface of the plating film layer such that the side surface of the plating film layer replicates the mesh-like unevenness.
Dependencies are inferred from the claim text.