Roughening solution for rolled copper foil and method for producing roughened copper foil
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMasami Sone, Hiroshi Matsunaga, Satoshi Tamai
Life of this patent
Estimating the term…
Loading patent…
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsMasami Sone, Hiroshi Matsunaga, Satoshi Tamai
Estimating the term…
Provided is an aqueous composition for roughening the surface of a rolled copper foil. The aqueous composition contains hydrogen peroxide, sulfuric acid, and an azole compound and/or a salt thereof. Based on the total mass of the aqueous composition, the content of hydrogen peroxide is 0.1 to 5% by mass, the content of sulfuric acid is 0.5 to 15% by mass, and the content of the azole compound is 0.01 to 0.3% by mass. The molar ratio of hydrogen peroxide to sulfuric acid is in the range of 0.1 to 1.0. The azole compound is a benzotriazole compound and/or a tetrazole compound. Also provided are a method for roughening a copper foil using the aqueous composition, a method for producing a roughened copper foil using the aqueous composition, a roughened copper foil, and a flexible printed circuit board using the roughened copper foil.
An aqueous composition for roughening a surface of a rolled copper foil, the aqueous composition comprising:
An aqueous composition for roughening a surface of a rolled copper foil, the aqueous composition comprising:
Dependencies are inferred from the claim text.