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US 12,568,817 B2Granted
Surface functionalization of sinx thin film by wet etching for improved adhesion of metal-dielectric for HSIO
AssigneeIntel Corporation
InventorsYi Yang, Rahul N. Manepalli, Suddhasattwa Nad, Marcel Wall, Benjamin Duong
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Abstract
Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a plurality of first layers, where the first layers comprise an organic material. In an embodiment, a trace is embedded in the package substrate, and a second layer is over the trace, where the second layer comprises silicon and nitrogen. In an embodiment, the second layer is chemically bonded to the one of the first layers.
Claims11
An electronic package, comprising:
- a package substrate with a first layer, wherein the first layer comprises an organic material;
- a trace embedded in the package substrate;
- and
- a second layer over the trace, wherein the second layer comprises silicon and nitrogen, wherein the second layer is chemically bonded to the first layer, wherein the second layer comprises amine ligands at a surface between the second layer and the first layer, and wherein ones of the amine ligands are labeled with fluorine-containing molecules.
1 more element
An electronic system, comprising:
- a board;
- an electronic package coupled to the board, wherein the electronic package comprises:
- a package substrate with a first layer, wherein the first layer comprises an organic material;
- a trace embedded in the package substrate;
- and
- a second layer over the trace, wherein the second layer comprises silicon and nitrogen, wherein the second layer is chemically bonded to the first layer, wherein the second layer comprises amine ligands at a surface between the second layer and the first layer, and wherein ones of the amine ligands are labeled with fluorine-containing molecules;
- and
- a die coupled to the electronic package.
5 more elements
Dependencies are inferred from the claim text.