H05K 3/386
By the use of an organic polymeric bonding layer
Official title: {by the use of an organic polymeric bonding layer, e.g. adhesive}
H05K3/386 (By the use of an organic polymeric bonding layer) appears on 1,207 US grants and 1,111 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,207
- Published applications
- 1,111
- Assignees
- 615
- Inventors
- 3,028
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 7 | 0 |
| 1978 | 10 | 0 |
| 1979 | 2 | 0 |
| 1980 | 4 | 0 |
| 1981 | 8 | 0 |
| 1982 | 12 | 0 |
| 1983 | 10 | 0 |
| 1984 | 14 | 0 |
| 1985 | 9 | 0 |
| 1986 | 21 | 0 |
| 1987 | 24 | 0 |
| 1988 | 20 | 0 |
| 1989 | 26 | 0 |
| 1990 | 18 | 0 |
| 1991 | 27 | 0 |
| 1992 | 32 | 0 |
| 1993 | 33 | 0 |
| 1994 | 28 | 0 |
| 1995 | 23 | 0 |
| 1996 | 24 | 0 |
| 1997 | 22 | 0 |
| 1998 | 28 | 0 |
| 1999 | 33 | 0 |
| 2000 | 26 | 0 |
| 2001 | 37 | 18 |
| 2002 | 37 | 57 |
| 2003 | 37 | 56 |
| 2004 | 37 | 49 |
| 2005 | 35 | 79 |
| 2006 | 28 | 66 |
| 2007 | 31 | 74 |
| 2008 | 28 | 72 |
| 2009 | 30 | 96 |
| 2010 | 37 | 95 |
| 2011 | 43 | 49 |
| 2012 | 55 | 32 |
| 2013 | 25 | 24 |
| 2014 | 29 | 32 |
| 2015 | 22 | 28 |
| 2016 | 18 | 23 |
| 2017 | 19 | 25 |
| 2018 | 8 | 33 |
| 2019 | 31 | 38 |
| 2020 | 36 | 28 |
| 2021 | 26 | 33 |
| 2022 | 25 | 22 |
| 2023 | 19 | 33 |
| 2024 | 22 | 19 |
| 2025 | 12 | 18 |
| 2026 | 5 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
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- Manufacturing methods for copper-clad laminate and printed wiring board13 Jan 2026US 12,526,929 B2Mitsui Mining & Smelting Co., Ltd.
- Low dielectric resin composition, adhesiveness-imparting agent, low dielectric adhesive composition, low dielectric adhesive molded product, low dielectric adhesive, and laminate3 Sep 2026US 2026/0258237 A1Mitsui Chemicals, Inc.
- Power module and assembly method therefor16 Jul 2026US 2026/0206145 A1MetaPWR Electronics Co., Ltd.
- Multilayer substrate25 Jun 2026US 2026/0181769 A1Fujikura Ltd.
- Electronic device and manufacturing method thereof25 Jun 2026US 2026/0181774 A1Innolux Corporation
- Method of forming metal pattern, substrate including the metal pattern, and electronic device including the metal pattern30 Apr 2026US 2026/0122791 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces260US 7,225,537 B2CardXX, Inc. · 2007
- Method of manufacturing an interconnect device having coplanar contact bumps229US 5,072,520 ARogers Corporation · 1991
- In situ method for forming a capacitive PCB173US 5,261,153 AZycon Corporation · 1993
- Semiconductor device and method for manufacturing substrate of the same147US 6,351,031 B1Fujitsu Limited · 2002