H05K 3/387
For electroless plating
Official title: {for electroless plating (H05K3/4661 takes precedence)}
H05K3/387 (For electroless plating) appears on 186 US grants and 152 published applications in this corpus.
Search patents in H05K- Granted patents
- 186
- Published applications
- 152
- Assignees
- 120
- Inventors
- 473
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 5 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 10 | 0 |
| 1990 | 3 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 6 | 0 |
| 1995 | 6 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 2 |
| 2002 | 4 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 2 |
| 2005 | 1 | 6 |
| 2006 | 3 | 3 |
| 2007 | 1 | 8 |
| 2008 | 1 | 5 |
| 2009 | 0 | 25 |
| 2010 | 3 | 15 |
| 2011 | 7 | 14 |
| 2012 | 14 | 5 |
| 2013 | 4 | 4 |
| 2014 | 9 | 8 |
| 2015 | 2 | 9 |
| 2016 | 3 | 4 |
| 2017 | 9 | 5 |
| 2018 | 3 | 6 |
| 2019 | 2 | 6 |
| 2020 | 6 | 6 |
| 2021 | 5 | 4 |
| 2022 | 3 | 3 |
| 2023 | 0 | 5 |
| 2024 | 4 | 5 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper clad laminate and method for producing the same14 Apr 2026US 12,604,417 B2Toyo Kohan Co.Ltd
- Printed circuit board22 Oct 2024US 12,127,343 B2Samsung Electro-Mechanics Co., Ltd.
- Printed wiring board2 Jul 2024US 12,028,988 B2Ibiden Co., Ltd.
- Protection tape for printed circuit board and display device including the same21 May 2024US 11,987,031 B2Samsung Display Co., Ltd.
- Laminate2 Apr 2024US 11,946,143 B2Arisawa Mfg.Co., Ltd.
- Protection tape for printed circuit board and display device including the same12 Sep 2024US 2024/0300208 A1Samsung Display Co., Ltd.
- Method for forming metal layers on glass-containing substrate, and resulting device29 Aug 2024US 2024/0292523 A1Corning Incorporated
- Component Carrier With Photosensitive Adhesion Promoter and Method of Manufacturing the Same11 Jul 2024US 2024/0237230 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wiring body, mounting substrate, wiring-equipped wiring transfer plate, wiring body intermediate material, and method for manufacturing wiring body2 May 2024US 2024/0145374 A1Panasonic Intellectual Property Management Co., Ltd.
- Polymeric composition for use in electroless plating, method of elecroless plating, and polymeric article made by electroless plating11 Apr 2024US 2024/0117170 A1
Most cited
By later US patents
- Method of manufacturing multilayer printed wiring board145US 5,826,330 AHitachi AIC Inc. · 1998
- Multilayer printed wiring board and method of manufacturing multilayer printed wiring board90US 6,828,510 B1Ibiden Co., Ltd. · 2004
- Process for producing printed wiring boards62US 5,153,987 AHitachi Chemical Company, Ltd. · 1992
- Radiation shielding fabric61US 5,275,861 AMonsanto Company · 1994
- Coating composition48US 5,120,578 AShipley Company, L.L.C. · 1992