Printed wiring board
AssigneeIbiden Co., Ltd.
InventorTakuya Inishi
Life of this patent
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Abstract
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer and including one or more conductor circuits, an insulating adhesive layer covering a surface of the conductor layer and a part or parts of the insulating layer exposed from the conductor layer, and a resin insulating layer formed on the insulating layer and the conductor layer such that the insulating adhesive layer is sandwiched between the conductor layer and the resin insulating layer. The insulating adhesive layer includes a first portion covering an upper surface of the one or more conductor circuits and a second portion covering a side surface of the one or more conductor circuits and a thickness of the first portion is greater than a thickness of the second portion.
Claims20
A printed wiring board comprising:
- an insulating layer;
- a conductor layer formed on the insulating layer and including at least one conductor circuit;
- an insulating adhesive layer covering a surface of the conductor layer and part of the insulating layer exposed from the conductor layer;
- and
- a resin insulating layer formed on the insulating layer and the conductor layer such that the insulating adhesive layer is sandwiched between the conductor layer and the resin insulating layer,
- wherein the insulating adhesive layer includes a first portion covering an upper surface of the at least one conductor circuit and a second portion covering a side surface of the at least one conductor circuit and a thickness of the first portion is greater than a thickness of the second portion.
Dependencies are inferred from the claim text.