Process for producing printed wiring boards
AssigneesHitachi Chemical Company, Ltd., Hitachi Condenser Co., Ltd., The Yokohama Rubber Co., Ltd.
InventorsHiroshi Takahashi, Shin Takanezawa, Masao Kanno, Toshiro Okamura, Naoki Fukutomi, Hiroyoshi Yokoyama, Hideo Watanabe, Hajime Yamazaki, Hiroyuki Wakamatsu, Toshinobu Takahashi
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Abstract
By using a composite film comprising an additive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components, printed wiring boards having a higher circuit density and higher reliability can be produced simply and effectively.
Claims12
A process for producing a printed wiring board, which comprises
- laminating a composite film comprising an adhesive layer and an insulating layer containing an epoxy resin and a synthetic rubber as major components on both sides of a substrate under reduced pressure, the viscosity of the insulating layer of the composite film at the time of laminating on the substrate being in the range of 10.sup.3 to 10.sup.5 poise,
- curing the resulting laminate with heating,
- drilling through-holes in the resulting laminate,
- masking non-circuit forming portions with a plating resist,
- dipping the resulting laminate in a chemical roughening solution to selectively roughen circuit forming portions not masked with the resist, and
- dipping the resulting laminate in an electroless copper plating solution to form conductor patterns.
A process for producing a multi-layer printed wiring board, which comprises
- binding a composite film comprising an insulating resin layer and an adhesive layer to both sides of an inner layer circuit substrate so as to contact the insulating resin layer with the inner layer circuit substrates,
- heating under pressure the resulting laminate to bind, the insulating resin layer having greater flowing properties than the adhesive layer at the time of binding with heating under pressure,
- drilling through-holes in the resulting laminate,
- masking non-circuit portions with a plating resist,
- dipping the resulting laminate in a chemical roughening solution to selectively roughen circuit forming portions not masked with the resist, and
- dipping the resulting laminate in an electroless copper plating solution to form conductor patterns.
A process for producing a multi-layer printed wiring board, which comprises
- binding a composite film comprising an insulating resin layer and an adhesive layer to both sides of an inner layer circuit substrate so as to contact the insulating resin layer with the inner layer circuit substrate, the composite film further comprising an insulating film laminated on the adhesive layer,
- heating under the resulting laminate to bind,
- drilling through-holes in the resulting laminate,
- masking non-circuit forming portions with a plating resist,
- dipping the resulting laminate in a chemical roughening solution to selectively roughen circuit forming portions not masked with the resist, and
- dipping the resulting laminate in an electroless copper plating solution to form conductor patterns.
Dependencies are inferred from the claim text.