Wiring body, mounting substrate, wiring-equipped wiring transfer plate, wiring body intermediate material, and method for manufacturing wiring body

A wiring-equipped wiring transfer plate which is a wiring transfer plate on which transfer wiring to be transferred to another component is formed, the wiring-equipped wiring transfer plate comprising:

• a base;
• a release layer formed on the base;
• a transfer plate insulating layer covering the base with an opening above the release layer;
• a projecting structure formed on the transfer plate insulating layer, the projecting structure for forming, in an insulating layer of a component to which the wiring is to be transferred, a via hole for a via electrode;
• a plating film formed on the release layer, in the opening;
• and
• an adhesion film covering at least a side surface of the projecting structure, wherein
• the plating film and the adhesion film are transfer wiring to be transferred to another component.

A wiring body intermediate material which is an intermediate material for a wiring body disposed above a substrate including a conductor, the wiring body intermediate material comprising:

• an insulating layer that is located above the substrate and includes a recess;
• an adhesion film formed over an inner surface and a bottom surface of the recess and a main surface of the insulating layer;
• and
• wiring located above the adhesion film, wherein
• the recess is located above the conductor and recessed from a main surface of the insulating layer.

A method for manufacturing a wiring body, the method comprising:

• preparing a substrate including a conductor;
• preparing a wiring-equipped wiring transfer plate including a wiring transfer plate on which wiring is formed;
• forming an insulating layer between the substrate and the wiring-equipped wiring transfer plate by disposing an insulating material between the substrate and the wiring-equipped wiring transfer plate;
• and
• separating the wiring transfer plate included in the wiring-equipped wiring transfer plate from the insulating layer, wherein
• the wiring-equipped wiring transfer plate includes:
• a base;
• a release layer formed on the base;
• a transfer plate insulating layer covering the base with an opening above the release layer;
• a projecting structure, for forming a via hole in the insulating layer, formed on the transfer plate insulating layer;
• a plating film formed on the release layer, in the opening;
• and
• an adhesion film covering at least a side surface of the projecting structure,
• in the forming of the insulating layer, the projecting structure of the wiring-equipped wiring transfer plate is disposed within the insulating material, and
• by separating the wiring transfer plate, a recess corresponding to the via hole is formed in a portion of the insulating layer on the conductor, the adhesion film is transferred to an inner surface of the recess in the insulating layer, and the plating film formed on the wiring-equipped wiring transfer plate is transferred to the insulating layer.