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US 12,127,343 B2Granted
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorDong Joo Shin
Life of this patent
Estimating the term…
Abstract
A printed circuit board includes a first insulating layer; a first circuit pattern embedded in the first insulating layer; a second insulating layer disposed on the first insulating layer; a via hole penetrating at least a portion of each of the first and second insulating layers; and an adhesive layer disposed on at least a portion of a side surface of the via hole.
Claims24
A printed circuit board, comprising:
- a first insulating layer;
- a first circuit pattern embedded in the first insulating layer;
- a second insulating layer disposed on the first insulating layer;
- a via hole penetrating at least a portion of each of the first and second insulating layers;
- and
- an organic adhesive layer disposed on at least a portion of a side surface of the via hole and extending to at least a portion of a region of the second insulating layer where a second circuit pattern is not disposed without covering a surface of the first circuit pattern exposed through the via hole.
3 more elements
The printed circuit board comprising:
- a first insulating layer;
- a first circuit pattern embedded in the first insulating layer;
- a second insulating layer disposed on the first insulating layer;
- a via hole penetrating at least a portion of each of the first and second insulating layers;
- an organic adhesive layer disposed on at least a portion of a side surface of the via hole;
- and a surface treatment layer disposed on a portion of the first circuit pattern that is exposed to the via hole, a side surface of the surface treatment layer contacting the first insulating layer, wherein the organic adhesive layer is in contact with the surface treatment layer on the side surface of the via hole.
3 more elements
A printed circuit board, comprising:
- a plurality of insulating layers;
- a plurality of organic adhesive layers, at least one of which is disposed on an entirety of an upper surface of at least one of the plurality of insulating layers;
- a plurality of circuit patterns each disposed on at least a portion of an upper surface of a respective one of the plurality of organic adhesive layers;
- and a plurality of vias each penetrating at least two of the plurality of insulating layers and connected to at least a portion of a respective one of the plurality of circuit patterns, wherein the plurality of organic adhesive layers do not cover respective portions of the plurality of circuit patterns exposed through respective of the plurality of vias wherein the plurality of organic adhesive layers extend to respective side surfaces of the plurality of vias, and are respectively disposed between a plurality of interfacial surfaces between the plurality of insulating layers and the plurality of vias.
1 more element
A printed circuit board, comprising:
- a first insulating layer;
- a first circuit pattern embedded in the first insulating layer;
- a second insulating layer disposed on the first insulating layer;
- a second circuit pattern disposed on the second insulating layer;
- a via penetrating at least a portion of each of the first and second insulating layers, and connecting the first circuit pattern to the second circuit pattern;
- and an organic adhesive layer disposed between a portion of the via and a portion of the first and second insulating layers, wherein the organic adhesive layer extends onto at least a portion of an upper surface of the second insulating layer where the second circuit pattern is not formed without covering a surface of the first circuit pattern exposed through the via.
3 more elements
Dependencies are inferred from the claim text.