US 7,225,537 B2Granted

Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces

AssigneeCardXX, Inc.

InventorPaul Reed

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Abstract

Memory Cards containing Integrated Circuits and other electronic components (e.g. resistors) in a variety of form factors having high quality external surfaces of polycarbonate, synthetic paper (e.g. Teslin), or other suitable material (e.g. PVC) can be made through use of injection molded thermoplastic material or thermosetting material that becomes the core layer of said Memory Cards and similar devices. The object of the invention is to provide the following properties to Memory Cards: rapid production cycle, high volume manufacturing throughput, security, electronics protection, better tamper resistance, durability, and highly reliable complex electronics encapsulation, achieved through a process utilizing low temperature and low pressure.

Claims43

Dependent claims

A method for making a Memory Card or similar device comprising a top layer of synthetic paper or other suitable material, a bottom layer of synthetic paper or other suitable material, and a core layer in which electronic components reside, said method comprising:

(1) constructing a bottom layer with precisely positioned openings for external electrical contacts;
(2) placing at least one mound of low shrinkage glue on an inside surface of the bottom layer;
(3) mounting an electronic component, having external electrical contacts, on the at least one mound of low shrinkage glue, thereby forming a bottom layer assembly, wherein the external electrical contacts are positioned in alignment with the openings in the bottom layer;
(4) partially curing the at least one mound of low shrinkage glue, wherein the electronic component is secured in a stable position;
(5) positioning the bottom layer assembly in a bottom mold;
(6) positioning the top layer in a top mold;
(7) closing the top mold to the bottom mold in a manner that creates a void space between the top layer and bottom layer;
(8) injecting a thermosetting polymeric material into the void space at temperature and pressure conditions which are such that:
(a) the electronic component is secured in position by the partially cured glue while the electronic component and partially cured glue are immersed in the thermosetting material, (b) gases and excess polymeric material are driven out of the void space, (c) the electronic component is encapsulated in the thermosetting polymeric material before the partially cured glue becomes completely cured, (d) the shrinking of the partially cured glue as it is fully cured brings the lower surface of the external electrical contacts flush with the bottom surface of the bottom layer, and (e) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor Memory Card body;
(9) removing the unified precursor Memory Card body from the mold device;
and
(10) trimming the precursor Memory Card or similar device to a desired dimension to produce a Memory Card.

9 more elements

A method for making a Memory Card or similar device comprising a top layer, a core layer in which an electronic component is embedded and a bottom layer, said method comprising:

(1) constructing a bottom layer with precisely positioned openings for external electrical contacts;
(2) placing at least one mound of low shrinkage glue having a volume of less than 0.1 cc on an inside surface of the bottom layer;
(3) mounting an electronic component, having external electrical contacts, on the at least one mound of low shrinkage glue, thereby forming a bottom layer assembly, wherein the external electrical contacts are positioned in alignment with the openings in the bottom layer;
(4) curing the mound of low shrinkage glue from 10 percent to 90 percent of the total curing the glue will experience in a period of time less than 5 seconds, wherein the electronic component is secured in a stable position;
(5) positioning the bottom layer assembly in a bottom mold;
(6) positioning a top layer in a top mold;
(7) closing the top mold to the bottom mold in a manner that creates a void space between the top layer and bottom layer;
(8) injecting a thermosetting material into the void space at a temperature between 65° F. and 70° F. and at a pressure between 80 psi and 120 psi which are such that:
(a) the electronic component is held in place by the mound of partially cured glue while the electronic component and mound of partially cured glue are immersed in the thermosetting material, (b) gases and excess polymeric material are driven out of the void space, (c) the electronic component is encapsulated in the thermosetting polymeric material before the partially cured glue becomes completely cured, (d) the shrinking of the partially cured glue as it is fully cured brings the lower surface of the external electrical contacts flush with the bottom surface of the bottom layer, and (d) the thermosetting polymeric material bonds with both the top layer and the bottom layer to produce a unified precursor Memory Card body;
(9) removing the unified precursor Memory Card or similar device body from the mold device;
and
(10) trimming the precursor Memory Card to a desired dimension to produce a Memory Card.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/044,329Filed 27 Jan 2005
Published: US 2006/0162156 A127 Jul 2006
Granted: 5 Jun 2007
Term ends: Not estimatedThe source records don’t support an estimate.

Classification30 codes

B29C 45/14647
For obtaining an insulating effect, e.g. for electrical components: making flat card-like articles with an incorporated IC or chip module, e.g. IC…
H05K 3/284
Applying non-metallic protective coatings: for encapsulating mounted components
H10W 74/016
Manufacture or treatment: using moulds
H10W 74/121
The semiconductor body being completely enclosed: by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation