B81C 1/00261
Processes for packaging mems devices
Official title: {Processes for packaging MEMS devices (MEMS packages B81B7/0032, packaging of smart-MEMS B81C1/0023)}
B81C1/00261 (Processes for packaging mems devices) appears on 2,179 US grants and 2,571 published applications in this corpus.
Search patents in B81C- Granted patents
- 2,179
- Published applications
- 2,571
- Assignees
- 587
- Inventors
- 3,379
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 7 |
| 2002 | 16 | 21 |
| 2003 | 14 | 34 |
| 2004 | 28 | 77 |
| 2005 | 55 | 103 |
| 2006 | 53 | 81 |
| 2007 | 45 | 107 |
| 2008 | 52 | 93 |
| 2009 | 63 | 80 |
| 2010 | 71 | 72 |
| 2011 | 82 | 77 |
| 2012 | 64 | 106 |
| 2013 | 86 | 116 |
| 2014 | 123 | 131 |
| 2015 | 164 | 189 |
| 2016 | 163 | 168 |
| 2017 | 166 | 187 |
| 2018 | 143 | 148 |
| 2019 | 143 | 133 |
| 2020 | 158 | 157 |
| 2021 | 101 | 108 |
| 2022 | 95 | 88 |
| 2023 | 82 | 78 |
| 2024 | 73 | 81 |
| 2025 | 63 | 70 |
| 2026 | 43 | 59 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 1/00269Bonding of solid lids or wafers to the substrate680
- B81C 1/00301Connecting electric signal lines from the mems device with external electrical signal511
- B81C 1/00277For maintaining a controlled atmosphere inside of the cavity containing the mems490
- B81C 1/00333Aspects relating to packaging of mems devices, not covered by groups b81c1/00269398
- B81C 1/00309Suitable for fluid transfer from the mems out of the package or164
- B81C 1/00325For reducing stress inside of the package structure119
- B81C 1/00317Packaging optical devices95
Recent patents
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- Process for manufacturing a micro-electro-mechanical device including two chambers at different pressures and related micro-electro-mechanical device1 Sep 2026US 12,722,969 B2STMicroelectronics S,r.l.
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Vacuum encapsulation24 Sep 2026US 2026/0285675 A1Obsidian Sensors, Inc.
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
- Through-hole electrode substrate, mems device, manufacturing method of mems device, and multilayered device17 Sep 2026US 2026/0274651 A1TDK Corporation
Most cited
By later US patents
- Semiconductor device including eutectic bonding portion and method for manufacturing the same314US 6,555,901 B1Denso Corporation · 2003
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips273US 9,368,429 B2Intel Corporation · 2016
- Display device with micromechanical leaf spring switches250US 4,681,403 AU. S. Philips Corporation · 1987
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013