B81C 1/00317
Packaging optical devices
Official title: {Packaging optical devices}
B81C1/00317 (Packaging optical devices) appears on 95 US grants and 117 published applications in this corpus.
Search patents in B81C- Granted patents
- 95
- Published applications
- 117
- Assignees
- 55
- Inventors
- 211
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 1 |
| 2003 | 1 | 0 |
| 2004 | 0 | 1 |
| 2005 | 1 | 2 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 3 |
| 2010 | 1 | 4 |
| 2011 | 2 | 1 |
| 2012 | 3 | 0 |
| 2013 | 1 | 3 |
| 2014 | 1 | 3 |
| 2015 | 3 | 9 |
| 2016 | 6 | 7 |
| 2017 | 11 | 9 |
| 2018 | 6 | 10 |
| 2019 | 3 | 10 |
| 2020 | 16 | 17 |
| 2021 | 7 | 10 |
| 2022 | 5 | 6 |
| 2023 | 12 | 6 |
| 2024 | 7 | 5 |
| 2025 | 3 | 3 |
| 2026 | 4 | 5 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Wafer level proximity sensor and method of making same16 Jun 2026US 12,655,017 B2STMicroelectronics International N. V.
- Hermetically sealed glass package7 Apr 2026US 12,595,169 B2Schott AG
- Hermetically sealed glass package10 Feb 2026US 12,550,779 B2Schott AG
- Process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface3 Feb 2026US 12,540,070 B2STMicroelectronics S,r.l.
- Infrared detector forming method and associated infrared detector23 Dec 2025US 12,504,328 B2Lynred
- Glass cover manufacturing using a single-crystal silicon mold11 Jun 2026US 2026/0158755 A1Murata Manufacturing Co., Ltd.
- Methods for forming an optical package11 Jun 2026US 2026/0159380 A1Infineon Technologies AG
- Window cavity wafers4 Jun 2026US 2026/0153380 A1Materion Corporation
- Dielectric stack for microelectromechanical system devices and methods of fabrication thereof30 Apr 2026US 2026/0116740 A1Texas Instruments Incorporated
- Semiconductor package and method of manufacturing the same12 Feb 2026US 2026/0043968 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Flip-chip assembly of protected micromechanical devices45US 6,507,082 B2Texas Instruments Incorporated · 2003
- Method for packing a display device and the device obtained thereof15US 7,746,539 B2QUALCOMM MEMS Technologies, Inc. · 2010
- Housing for micro-mechanical and micro-optical components used in mobile applications14US 8,201,452 B2Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e. V. · 2012
- Method for stripping sacrificial layer in MEMS assembly11US 6,951,769 B2Texas Instruments Incorporated · 2005
- Lid structure for microdevice and method of manufacture5US 7,968,986 B2Innovative Micro Technology · 2011